Used RUDOLPH FE VII/IV #9412377 for sale
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ID: 9412377
Wafer Size: 8"
Vintage: 2002
Thickness measurement system, 8"
2002 vintage.
RUDOLPH Fe VII/IV Wafer Testing and Metrology equipment is a highly accurate and precise testing device used in the semiconductor industry for silicon wafer manufacturing. This inspection and metrology solution facilitates automated wafer testing and diagnostics. It is designed to detect fault conditions in the wafer, evaluate its performance, and provide quality control data to improve the overall production process. With a fast cycle time of 2 ms, the system is capable of achieving repeatable and repeatable measurements with a high level of accuracy. RUDOLPH Fe VII/IV offers directional mapping, which allows users to obtain a surface profile of a wafer and calculate the total thickness from just a few points. Additionally, the unit can measure film thickness down to 10nm, which is highly advantageous for low-noise wafers. This machine is capable of assessing numerous types of test items, ranging from die stamping to line widths, layer thickness, plating and instrumentation. Furthermore, the tool has advanced feature recognition algorithms and algorithms for non-contact evaluations. RUDOLPH Fe VII/IV is a modular device, and numerous options can be integrated into the asset, depending on user requirements. These options include a CD/OCD Measurement add-on feature, Stress Measurement software, and a Cathodoluminescence add-on. RUDOLPH Fe VII/IV can be connected to data processing systems such as LIS, SECS-II, and GEM. The model also comes with a graphical user interface that provides interactive control and helps the user navigate the equipment. In conclusion, RUDOLPH Fe VII/IV is a reliable, user-friendly, and powerful system that is essential for the successful fabrication of silicon wafers. With accurate measurements and versatile features such as feature recognition and automated process evaluations, it proves to be an excellent tool for wafer testing and metrology.
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