Used RUDOLPH MetaPulse 300 #9262861 for sale

RUDOLPH MetaPulse 300 is a high accuracy and fully automated wafer testing and metrology equipment. It is designed to provide information regarding wafer uniformity and defectivity for semiconductor processes. It uses an optical head coupled with advanced software to measure wafer characteristics quickly and accurately. The first step is to introduce the wafer to the test station, where MetaPulse 300 takes measurements of its overall thickness and curvature, as well as its wafer defectivity. The measurement data is then processed through its Image Analysis and Defect Inspection Programs to detect geometry deviations, contamination, impurities, and other defects. The system uses high-resolution optics to collect precise information and employ fuzzy logic for a complete picture of the wafer's state. The second step is to evaluate the wafer planarity or waviness. The unit uses a unique 3D vibration sense technology to measure the average profile and waviness of the wafer surface. With its feature-recognition algorithms, it can also identify a wide variety of planarity-related defects, such as screeds, steps, globules, and misalignment of die attach pads. The third step is to measure critical profiles, such as pins, holes, and vias. This step is important because these measurements must be determined to ensure the wafer's integrity, such as the continuity of signal paths between devices. RUDOLPH MetaPulse 300's automated feature recognition software is capable of analyzing and summarizing profiles with extreme accuracy. The fourth step is to analyze wafer orientation and position. The machine is capable of checking the wafer's orientation with respect to the supporting surface, in order to ensure proper placement of the wafer for subsequent processing. Using a reference image, MetaPulse 300 has the ability to detect misaligned or misshapen components, as well as verify datum precision. With RUDOLPH MetaPulse 300, users are able to ensure exact wafer dimension and condition, enabling them to improve their production yields and optimize their processes. Its ability to measure 3D profiles is backed by advanced imaging, defect recognition and analysis technology, making it one of the most reliable wafer measurement systems on the market.