Used RUDOLPH MetaPulse 300 #9401107 for sale

ID: 9401107
Vintage: 2001
Film thickness measurement system 2001 vintage.
RUDOLPH MetaPulse 300 is a highly accurate and reliable wafer testing and metrology system. Specifically, it can be used to analyze and measure the quality of thin-film coating layers of components used in advanced microelectronics applications, such as optical and photovoltaic devices. MetaPulse 300 offers superior analytical capabilities for both thin-film layers and large area substrates. Compared to traditional destructive testing techniques, RUDOLPH MetaPulse 300 uses a non-contact, non-destructive optical technique to measure optical properties with high accuracy and high resolution. This makes it particularly well-suited for measuring thin-film layers on substrates, as well as creating maps of crystalline orientations, defects and other effects. MetaPulse 300 comes with a proprietary RUDOLPH 4D package, which offers a comprehensive metrology solution. This includes a built-in high-resolution RGB-Laser system and high-end optics. As a result, it can identify and measure both optical properties and defects on wafers. Additionally, it can provide a complete characterization of the substrate surface, such as crystalline orientation maps and detailed surface topography maps. RUDOLPH MetaPulse 300 can also be used to measure electrical properties, such as resistance and capacitance, on thin-film layers. This can be done without damaging or affecting the sample in any way. It also includes advanced algorithms for flaw detection and measurement, which can help detect and diagnose any abnormalities. On top of this, MetaPulse 300 is highly configurable and can be tailored to suit virtually any application. It is designed for use in high-volume production environments and comes with an intuitive, user-friendly interface. It is also designed for use in demanding applications, such as clean rooms and temperature controlled chambers, where stability and accuracy are important. Overall, RUDOLPH MetaPulse 300 offers a comprehensive, non-destructive, high-precision wafer testing and metrology solution, making it a valuable tool for measuring the properties of all types of thin-film layers and substrates.
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