Used RUDOLPH MetaPulse 300X-CU #293635144 for sale
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ID: 293635144
Thin film thickness measurement system
Missing parts:
Robot hand
Controller.
RUDOLPH MetaPulse 300X-CU is a highly advanced wafer testing and metrology equipment that has been designed to maximize efficiency and accuracy in the wafer testing and metrology field. This sophisticated system is capable of performing numerous tasks and processes, starting from sheet through non-contact planar imaging and mapping. MetaPulse 300X-CU includes a wide array of measuring capabilities. It combines modern imaging techniques such as optical and electron microscopy with a range of metrology techniques, such as laser interferometric techniques and optical wavefronts analysis. This customizable imaging solution is also equipped with powerful, automated defect characterization and analysis software that are designed to quickly and accurately identify and characterize defects. One of the most attractive features of RUDOLPH MetaPulse 300X-CU is its high throughput and speed of operation. This unit is capable of processing up to 150 wafers every hour and can measure more than 50 parameters on each wafer. MetaPulse 300X-CU can be configured to meet any specific wafer testing and metrology requirements that a customer may need. Another great advantage of RUDOLPH MetaPulse 300X-CU is its flexibility and the ability to easily customize metrology techniques that cater to a wide range of customer needs. This machine can be used for a variety of applications such as resistivity, resistivity mapping, x-ray imaging, contact profilometry, optical scattering, and nuclear magnetic resonance spectroscopy. It can also be used to perform general wafer inspection, such as determining thickness, surface roughness, and dimensions. MetaPulse 300X-CU provides precise, accurate, and repeatable results with the lowest possible deviation from physical parameters. This device is built with top-of-the-line technologies, allowing for high-end results and improved productivity. Its advanced image analysis algorithms and high-speed scanning rates make it a perfect choice for the most demanding testing and metrology applications. In short, RUDOLPH MetaPulse 300X-CU is an excellent wafer testing and metrology tool that is capable of delivering high accuracy, speed, and reliability. Its powerful capabilities, flexibility, and intuitive design make it well-suited for any testing and metrology task, making it an ideal choice for any demanding metrology requirements.
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