Used RUDOLPH MetaPulse-II 200X-Cu #293664999 for sale

RUDOLPH MetaPulse-II 200X-Cu is a wafer testing and metrology equipment that combines industry-leading accuracy and speed to provide unmatched testing and measurement capabilities. It consists of a 200mm chuck with eight electrode configuration that can be configured to meet the needs of multiple applications. The 200X-Cu features a high-speed, direct-drive Z-axis mechanism that enables fast and precise scanning of various test and metrology data, as well as maximum test throughput for faster inspection and measurement. The system is equipped with a high-resolution camera that allows for accurate profile measurement and defect analysis. It is also equipped with an automated sample alignment unit that allows for high precision tests without the need for manual alignment. MetaPulse-II 200X-Cu connects to several third-party software packages, allowing for seamless integration and streamlined data acquisition. It also supports the Measure MentorTM software package, which is designed for quick and easy defect characterization and qualification. The powerful and intuitive software package simplifies complex measurement analysis tasks, enabling faster, more accurate testing. RUDOLPH MetaPulse-II 200X-Cu also offers real-time, physical verification of multiple wafer tests, such as defect density and contact resistance. It enables fast, interactive assessment of the entire wafer surface, providing quick feedback on Defect/Particle Yield, Bulk and Edge Resistivity, and Stress Analysis. This makes the machine particularly effective for rapid, automated inline metrology. MetaPulse-II 200X-Cu provides superior accuracy and repeatability for wafer testing and metrology. It eliminates many manual steps in typical processes, providing high throughput, reproducible results, and reduced cost of ownership. The tool's high speed and accuracy make it the ideal choice for wafer testing and metrology in production environments.