Used RUDOLPH MetaPulse-III 300 #9383418 for sale

ID: 9383418
Thickness measurement system.
RUDOLPH MetaPulse-III 300 is a state-of-the-art wafer testing and metrology equipment that offers unparalleled performance and efficiency in the measurement of semiconductor wafers. The system combines advanced hardware, software, and user-friendly controls to drive up productivity and accuracy. The unit is designed to provide users with a fast and reliable method for probing and testing wafers. The machine consists of two main components: a polarization beam combiner (PBC) and a two-axis angle-resolved spectroscopic ellipsometer (ARSE). The PBC reflects a single polarized beam off the wafer surface to measure transmittance, reflectance, and absorbance. The ARSE works in conjunction with the PBC to measure the polarization characteristics of the wafer by measuring polarization changes and ratio changes. The tool includes a robust software package that allows users to easily set up and monitor tests. It offers a wide range of features including automated wafer analysis, 3D surface mapping, topography data, real-time defect inspection, programmable automation, and data logging. Additionally, the asset's dual-channel optical spectroscopy feature makes it possible to characterize both transmission and reflection spectra of a wafer simultaneously. MetaPulse-III 300 is ergonomically designed to promote operator comfort and safety. Its lightweight, compact design and robust construction make it ideal for use in both production and research environments. The model also offers users flexible options such as variable frequency sweeps, temperature control, and multi-point probing capabilities. Overall, RUDOLPH MetaPulse-III 300 is a powerful and versatile testing and metrology equipment that covers all the needs of modern wafer testing. Its combination of sophisticated hardware components, intuitive software, and ergonomic design enable users to consistently produce accurate results. As a result, MetaPulse-III 300 is an ideal choice for a wide range of applications such as high-precision semiconductor testing, research, and device fabrication.
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