Used RUDOLPH MetaPulse-III 300XCu #9353244 for sale

RUDOLPH MetaPulse-III 300XCu Wafer Testing and Metrology equipment is a fully automated system for wafer testing and metrology. This unit is designed to provide accurate and precise wafer results for a range of application, such as depth profiling, electrical characteristics, Thin Film properties, and non-destructive imaging. The single wafer configuration and the high degree of automation allow for an efficient configuration and operation of the machine, delivering a high throughput of wafer samples in a short amount of time. It is equipped with a fully integrated optical subsystem, that can be used for visual inspection and SEM or TEM imaging. The tool employs an advanced stage design, and a comprehensive suite of controllers and drivers. The controller suite consists of an analog/digital processor (ADP), a software-based control asset, a multi-mode controller, and a quantitative data acquisition processor (QDAP). The ADP is used for the critical performance measurements, including electrical and thermal measurements. It is also used to configure and control the model, which includes providing the necessary recognition algorithms, interfacing with the vacuum equipment, controlling the irradiation system, measuring the material surfaces, and providing the appropriate feedback to the user. RUDOLPH METAPULSE III 300XCU Wafer Testing and Metrology unit also features a patented Dual Beam Machine (DBS) optics, which enables the tool to provide thin film characterization and analyze three dimensional (3D) features with maximum accuracy. This feature enables reference-grade geometry measurements of features of any size and shape. It is equipped with a laptop for user convenience and a fully integrated user interface board, which simplifies user access to asset controls. The model also includes other features such as automated wafer placement, automated wafer identification, an analog/digital processor with option for acquiring data from the equipment, a library of aging functions, and the ability to configure custom operation parameters. METAPULSE III 300 XCU Wafer Testing and Metrology system is an ideal tool for performing rapid metrology and wafer surface analysis. Its integrated hardware and software makes it easy to setup and the user-friendly interface simplifies access to unit functions. The ADV Data Analysis Processor and Dual Beam Machine (DBS) optics provide quick and reliable wafer measurement and characterization, guaranteeing repeatable results to customers.