Used RUDOLPH MP 300XCU #9384457 for sale

RUDOLPH MP 300XCU is a state-of-the-art wafer testing and metrology equipment. It is designed for fast, precise measurements on semiconductorwafers and film substrates. The system features a large, 13.6" x 13.6" sample chamber to accommodate larger wafers and measurement area for multiple thin-film structures. With its dual-sided metrology capability, users can make accurate film thickness and electrical measurements on both sides of the wafer. RUDOLPH MP 300 XCU is equipped with a triple torque mechanical positioning unit to ensure rapid, parallel alignment of substrates and in-plane flatness, while providing high resolution to accurately measure feature sizes down to 1um. The unique G2 moving optics drive offers superior optics positioning accuracy and stability, with a range of up to ±50um, and speeds up to 10um/second. The highly accurate, non-destructive spectroscopic ellipsometer enables precise measurement of dielectric optical constants and surface roughness degradation. The built-in spectrograph is capable of measuring in the UV, VIS, and NIR wavelengths simultaneously, with a resolution of 0.03nm. MP 300XCU's ultra-fast microspot photometer helps identify and locate points of interest on the sample for further analysis. With its high-speed speed scanner and advanced algorithms, it can acquire images of feature sizes as small as 0.5um. The machine is also capable of performing detailed defect analysis. It features advanced high-magnification and high-sensitivity image processing, with advanced algorithms for defect characterization. It also includes depth estimation and shape identification. MP 300 XCU is the perfect choice for production testing environments that require high-accuracy and high-speed metrology measurements. With its advanced metrology, imaging, and defect analysis capabilities, it is the ideal tool for any wafer or substrate testing application.