Used RUDOLPH MP1-300XCU #9276771 for sale

RUDOLPH MP1-300XCU
ID: 9276771
Wafer Size: 12"
Vintage: 2008
Film thickness measurement system, 12" 2008 vintage.
RUDOLPH MP1-300XCU is a highly advanced wafer testing and metrology equipment designed to meet the needs of the semiconductor industry. It is optimized for fast and accurate metrology and characterization of wafers. The system includes a wafer stage that can accommodate wafers up to 300mm in diameter and an integrated optical metrology subsystem for measuring a wide range of features such as wafer thickness, area, and flatness. The performance of MP1-300XCU is driven by its cutting edge technology and industry-leading features. The unit comprises of a proprietary linear and rotary motors for robust and reliable motion control, as well as a state-of-the-art embedded controller and precision optics for superior metrology accuracy. The machine also offers advanced computer vision capabilities including automated wafer alignment through deep learning. The key features of RUDOLPH MP1-300XCU include a modular design for easy maintenance and upgradability, a multi-wavelength light source for rapid non-contact measurements, a high-precision imaging subsystem for superior resolution, and a web-based graphical user interface for intuitive software control. The tool also offers a wide range of integrated software features such as automated monitoring of process parameters, pass/fail analysis, traceability, and integration into automated wafer test systems. The software is designed for easy integration into existing systems and programs, and can be used to quickly identify defects and identify process parameters. MP1-300XCU is designed to meet the demanding requirements of the semiconductor industry, including the measurement of critical dimensions, flatness, and critical features. With its superior performance and robust features, the asset offers reliable testing and metrology solutions to a wide range of customers in the semiconductor fabrication and assembly industry.
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