Used RUDOLPH MP1 #9397713 for sale

RUDOLPH MP1 is a unique wafer testing and metrology equipment intended for challenging process control, advanced metrology and defect inspection applications in semiconductor and MEMS manufacturing. It is designed to be a cost-effective solution for verifying process control and advancing defect detection performance, as well as a reliable system for advanced research and development (R&D) tasks, providing a powerful combination of high-precision wafer scanning, defect characterization and automated imaging. MP1 features a wide range of advanced defect inspection capabilities, including automated wafer handling and scanning, defect classification, automated laser measurement and imaging, and powerful data analysis tools. The unit is equipped with a high-resolution, RGB camera for capturing color images of defects, and enables users to zoom in and out of areas of interest on the wafer by moving the camera over the specimen in a scan pattern. This feature makes it possible to characterize subtle defects, such as those with round edges, which can be difficult to inspect with conventional systems. RUDOLPH MP1 also features a high-performance, automatic wafer handling machine, designed to ensure accurate alignment and speed up the test process. This tool is capable of handling wafers up to 8 inches in diameter, with a scanning aperture of up to 200 x 200 mm, providing ample space for testing. MP1 also provides a powerful suite of hardware and software tools for automated defect detection and classification, which can be used to detect and categorize a wide range of defects, such as voids, contaminants, residue, and sub-surface defects. RUDOLPH MP1 also offers a suite of advanced metrology features, allowing users to obtain reliable measurements of features such as line and space widths, profile heights, Z-axis accuracies and flatness levels without the need for specialized tools. This sophisticated metrology asset can be used to characterize a wide range of structural features on wafers, such as line widths, densities, signal integrity, and pattern features. In conclusion, MP1 is an advanced wafer testing and metrology model designed to provide efficient and reliable process control, advanced defect detection and characterization capabilities, as well as powerful metrology features. It is equipped with an array of advanced hardware and software tools, and is capable of handling a variety of wafer sizes up to 8 inches in diameter, providing ample space for testing. The equipment is easy to use and can be used to detect and categorize a wide range of defects, as well as accurately measure structural features on wafers, making it an ideal solution for challenging process control, advanced metrology and defect inspection applications.