Used RUDOLPH S200 #9157249 for sale

RUDOLPH S200 is a wafer testing and metrology equipment that is designed for use in research labs, industrial and production testing applications. With its innovative design, it is able to accurately measure the electrical resistance and capacitance of ultra-thin wafers with unprecedented precision. RUDOLPH S 200 system features a 200mm AFM 6 MHz, 8-bit precision current-measuring head that supports a wide range of test voltages and up to 16 repeatable sampling points. This is combined with a proprietary 2-axis wafer leveling unit and a linear measuring time base, allowing for accurate and repeatable non-contact testing of both thin and thick wafers. The machine's easy-to-use design also features a large touch-screen display for ease of operation. For improved accuracy and repeatability, S200 features a negative zeroing procedure that quickly and precisely sets the test head to its origin before measurements are taken. This process ensures that the wafer's response to the applied current is accurately measured. The tool also features a high-speed measurement asset that uses advanced measurement algorithms to ensure precision and repeatability of the data collected, even over long-term tests. S 200 also features high-performance optical metrology and analysis capabilities that enable imaging of ultra-thin wafers and detailed analysis of the defect-free surfaces. Using a combination of angle-resolved scattering microscopy, defects are detected and accurately measured with sub-micron resolution. Additionally, RUDOLPH S200 offers the latest in wafer measurements for etch depth characterization and critical dimension (CD) measurements. Overall, RUDOLPH S 200 offers research laboratories, industrial and production testing applications an unmatched level of accuracy and repeatability for thin and thick wafers. Its innovative scanning head has been carefully designed for optimum precision and repeatability, while its high-end optical metrology and analysis capabilities enable the user to quickly and easily detect and measure surface defects and CD measurements with unmatched accuracy.