Used RUDOLPH WS 3840 #9136132 for sale
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ID: 9136132
Wafer Size: 12"
Vintage: 2010
Bump inspection system, 12"
Granite base air bearing XY stages
Vacuum chuck with rotation for 5", 6", 8" and 12" wafers
Z Slide for focus control and wafer loading / Unloading
OLYMPUS Optical head with 5 positions auto lens turret
Bright field lighting
Low angle dark field lighting
Objective lenses: 1.25x, 2.5x, 5x and 10x
4K TDI Line scan camera & electronics
Image frame grabber
Dual quad core XENON processor PC based 2D vision engine
Computer with 3.2GHz P4 processor
RAM: 1GB
Hard disk: 250 GB
(2) Hot swap bays
CDRW / DVDRW
Operating system: Window XP
Console arm with (2) flat panel color monitors
Keyboard and mouse
(4) Positions light tower
Data analysis and reporting
Color defect review
Mini-environment fan / Filter units (ISO Class 2)
Electronic wafer maps (KLAINF, EF, WWW, Semi G85 and SECS S12)
721713 Option
Xport
Wafer scanner
ISO Class 1 clean high speed wafer handling EFEM outfitted
With dual arm robot
Wafer thicknesses: (725um)
Down to 400 microns thickness for 12" wafers
Down to 190 microns thickness for 8" wafers
Automated whole wafer handling
Dual arm vacuum assist backside wafer handling
Minimal contact end effector
Integrated laminar clean air flow mini-environment (ULPA Filtration)
Robot with integrated mapper
721753 2 Option
Bridge load port
BROOKS Vision / Cassette pivot, 8"
XENON Dual quad processor 2D vision engine
72054 1 Option, 3D Inspection, Hi Res 3D Sensor
High resolution: 4 MHz
3D Sensor scans up to a .6mm swath
Depth of field: 200um
1U Rack mount chassis
Dual INTEL quad-core XENON processor 2.5 GHz
DRAM: 2GB
SATA Hard disk drive: 250 GB
CD ROM Drive
Ethernet
RUDOLPH PCIDSP Board
(5) Microns ultra high resolution 3D sensor
716983 1 Standard, 3D Height Verif Wafer, 100um, 300mm
716810 1 Option, Dual OCR
X Port
66807 1 Computer, Remote defect review
Wafer capability, 8"-12"
Ultra flat chuck: <5 Microns chuck
2010 vintage.
RUDOLPH WS 3840 is a wafer testing and metrology equipment designed for semiconductor device companies. It is an automated system to integrate and analyze metrology data from multiple measurement devices. The unit consists of a series of high-performance workstations connected to a central server, each processing and storing metrology data from a single measurement device. It is capable of processing multiple types of metrology data, including wafer area, pitch, die size, and die placement. The machine is highly accurate and repeatable, capable of detecting and analyzing changes in device structure quickly. It also features advanced 2D imaging functions to analyze defect counts and wafer features such as protrusions and die count. The tool also includes a host of other features, including easy-to-operate and intuitive software that allows users to quickly set up and access analysis data. It also features a parameter driven asset that allows customization of analysis data, output formats and user preferences. To ensure accuracy, the model utilizes pattern recognition to detect and analyze small variations in design. This includes adaptive optics which can adjust focus or provide improved illumination through an array of lenses. The equipment is built with a robust design, allowing for high levels of reliability and durability. It also provides advanced scalability, allowing users to easily perform large-scale metrology tasks. Finally, the system offers high levels of security, allowing for remote access and operations. It is compliant with several industry standards and comes with comprehensive support services, including installation, training and maintenance. In conclusion, RUDOLPH WS3840 is an advanced wafer testing and metrology unit designed to meet the needs of semiconductor device companies. It provides users with a range of features and capabilities, allowing for accurate and efficient metrology testing.
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