Used RUDOLPH WS 3880 #9225120 for sale
RUDOLPH WS 3880 is a wafer testing and metrology equipment designed for production and research testing. It utilizes a combination of optical and thermal metrology and can be used for a variety of applications, including testing of backside passivation and chip bond strength. RUDOLPH WS3880 is equipped with two high-resolution optical imaging systems and an advanced thermal metrology system capable of testing up to four wafers at a time. The optical imaging systems on WS 3880 feature a microspot illumination unit and 10x microscopes for viewing a variety of aspects of the wafer's surface. The microspot machine is used to accurately locate the boundaries around each device on the wafer. This tool is also able to locate trenches, holes and other features. The 10x microscopes provide a high-resolution view of the wafer's surface and are used to evaluate passivation thickness, doping uniformity and performance of the device. WS3880 also features an advanced thermal metrology asset that is designed to measure the amount of current drawn through the wafer's contact pads. This model is able to measure the current drawn through up to four different test pads with high accuracy and resolution, allowing for rapid and accurate analysis of chip bond strength. It also includes a range of environmental controls to ensure accurate results. In addition to the optical and thermal metrology systems, RUDOLPH WS 3880 also includes a comprehensive data management equipment to store and analyze test results. This system can store up to 10,000 data points, allowing for quick and efficient analysis. The data management unit also includes a graphical user interface that is used to easily view and analyze the data. Overall, RUDOLPH WS3880 is an advanced wafer testing and metrology machine that can be used for a variety of applications. Its combination of optical and thermal metrology, combined with the comprehensive data management tool, make WS 3880 an ideal solution for production and research testing.
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