Used SENSOFAR 3D Surface profilers #293672431 for sale
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ID: 293672431
SENSOFAR 3D Surface profilers is a wafer testing and metrology equipment that is designed to provide extremely accurate measurements of the three-dimensional shapes of surfaces. It uses advanced optical scanning technology to measure the surface topographies of semiconductor wafers with high-resolution and accuracy. The system combines a state-of-the-art optical interferometric instrument with a proprietary 3D profilometry algorithm to create a highly accurate and reliable tool for semiconductor wafer testing and analysis. The advanced optical scanning technology and the 3D profilometry algorithm enable the unit to capture highly detailed, accurate and precise shape measurements from the surface of the wafer. It measures not only the surface topography of a wafer, but also the various features and contours of the wafer surface. The machine is capable of measuring a variety of semiconductor wafers including mono- and multi-crystalline wafers, SOI (silicide on insulator) wafers, and bonded wafers. It also measures wafers which are highly reflective, and so capable of measuring extensive details of the surface. The tool can also measure thin-film surfaces with high speed and accuracy. 3D Surface profilers provides extremely accurate, resolution within +/- 5nm. It also operates at a high speed, generating a 3D profile of wafers in as little as 24 seconds. The measurements and results generated by the asset are highly reliable due to the advanced 3D profilometry algorithms. The model is highly flexible and upgradeable, allowing it to expand its capabilities to meet the needs of its customers. SENSOFAR 3D Surface profilers is a powerful and reliable equipment that provides highly accurate and detailed measurements of semiconductor wafers. It is capable of providing exceptional resolution and speed while maintaining high reliability and accuracy. This makes it an ideal choice for those who need to measure and analyze semiconductor wafers with precision.
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