Used SII NANOTECHNOLOGY / SEIKO Chips200 #9043060 for sale

ID: 9043060
Wafer Size: 8"
Test system, 8".
SII NANOTECHNOLOGY / SEIKO Chips200 is a wafer testing and metrology equipment that provides precise and real-time measurements of critical electrical, physical, and optical characteristics of semiconductor devices and materials. It enables the analysis of wafer surface data, including feature/strain measurement, nanometer scale analysis, and failure analysis. The system incorporates a unique range of imaging techniques, including optical polarized imaging, dark-field imaging, and electron backscatter diffraction (EBSD). These techniques allow for high-resolution imaging and functionality-specific analysis of a variety of features, such as grain boundaries, interface roughness, and micro-defects. The unit's dark-field imaging capability makes it possible to detect morphological features like dislocations, grain boundaries, twins, oxide layers, and more. This is especially useful for failure analysis, as it allows users to observe and locate a variety of defects. The EBSD technique, meanwhile, uses an electron beam to create a diffraction pattern of crystal orientations. This can be used to accurately measure the crystalline structures of the wafer, providing information on crystal orientation, grain size, and crystal defects. The machine is also equipped with advanced wafer metrology capabilities. It can automatically measure three-dimensional parameters including CD (critical dimension), contact hole size, line width, and overlay. This way, SEIKO Chips200 can quickly generate data that can be used to evaluate device performance. The tool is easy to setup and use. It comes with a graphical user interface (GUI) that is intuitive even for inexperienced users. It also features highly automated operation and data input, which makes it very efficient and cost-effective. Overall, SII NANOTECHNOLOGY Chips200 is a powerful and versatile wafer testing and metrology asset. It offers a wide range of capabilities for conducting high-precision measurements and analyses of semiconductor devices. Its advanced imaging techniques and automated operation make it an invaluable tool for monitoring device quality and performance.
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