Used SSM / SOLID STATE MEASUREMENTS SRP 150 #9404387 for sale

SSM / SOLID STATE MEASUREMENTS SRP 150 wafer testing and metrology equipment is an integrated platform for research and production applications. It enables ultra-high accuracy and high speed performance for measurements and inspections of thin film structures and thin-film processes used for device production. SSM SRP 150 system combines a wide range of measurement and inspection capabilities with advanced robotics for precise positioning and high throughput. The integrated platform includes an automated thin-film metrology module, a thin-film process inspection module and a wafer handling unit. The metrology module enables powerful in-line or off-line measurements of thin-film structures and thin-film processes. It is capable of measuring thin-film materials ranging from few nanometers to multiple millimeters in thickness. The module uses high-precision atomic force microscopy (AFM) probes along with advanced optics and highly sensitive detectors to accurately measure and inspect thin-film structures. The machine is capable of measuring film thickness, surface topography, surface roughness, surface profile and other parameters. The process inspection module allows for detection and evaluation of thin-film processes. It uses an array of sensors and detectors to measure temperature, force and vibration. The tool is able to measure such processes as deposition rate, deposition uniformity, uniformity of thin-film thickness, and defect characteristics. The wafer handling asset integrates a robotic model, sophisticated motion control algorithms, laser metrology and vision systems. The equipment is capable of positioning the wafers precisely with high positioning accuracy and repeatability. The robotic wafer handling system is capable of handling wafers of various sizes and with various layers of thin-film materials. SOLID STATE MEASUREMENTS SRP 150 unit is designed for applications where precision and accuracy are essential, such as thin-film deposition and other thin-film processes in the semiconductor industry. It is suitable for inspection and measurement in research and production applications, including film engineering, QA/QC, device static and dynamic characterization and defect analysis. SRP 150 machine is an advanced, integrated platform that provides not just ultra-high accuracy and high speed performance for wafer measurements and inspections, but also a set of powerful tools for process development, characterization and evaluation. With advanced robotics, sophisticated algorithms, high-precision AFM probes, advanced optics and vision systems, SSM / SOLID STATE MEASUREMENTS SRP 150 tool is an indispensable tool for research and production applications in the semiconductor industry.