Used TAYLOR HOBSON Surtronic 3 CPO #9012955 for sale
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ID: 9012955
Profilometer
Parameters: Ra
Traverse speeds: 1mm/s for measurement, 0.25mm/s for recording
Measurement ranges: 0-9.99 and 0-25μm, 0-999 μin Ra
Readout: Digital; liquid crystal display
cut-off values: 0.25, 0.8, 2.5 mm (0.01, 0.03, 0.1 inch) 0.8mm(0.03inch) over the full 25mm (0.98inch) traverse
Height of digits: approx. 6.5mm (0.25 inches)
Standard traverse lengths: Nominally 5X selected cut off + 0.5mm i.e. 1.75, 4.5, 13mm
Display: Four digits, decimal ("E") and measuring sign (---)
Output for recording: 10mV/μm on 99.9μm range
100mV/μm on 9.99μm range 1mV/μin on 999μin range
Minimum load impedance for recorder output: 10k
*Overall accuracy of Ry (RmaxDIN) & Rtm (RzDIN) measurement: To within 2% of reading +/- 1 unit in the least significant decimal.
TAYLOR HOBSON Surtronic 3 CPO is an automated 3D surface testing and metrology equipment developed to accurately measure and inspect wafer surfaces. This system is a gantry based, CNC controlled surface profiler that utilizes capacitance displacement sensors for manual and automated operation. It is designed specifically for research, development and production laboratories. The key hardware components of Surtronic 3 CPO consist of linear displacement measuring unit, variable speed scanning capabilities, 1,250mm x 1,250mm stage (i.e. traverse area) and 1,200mm height of z-axis travel. It also features a 1-axis, 3-axis and 5-axis automatic capability for sample alignment and repeatability. Furthermore, an integrated stage encoder and a moving LED light source is equipped for measurement repeatability and for improved feature inspection. The sample specific displays enable users to view the surface profile and critical feature information, as well as other surface characteristics such as Flatness, Bump Height, Corrugations and Wave Length. TAYLOR HOBSON Surtronic 3 CPO is capable of measure by profiles, surface scans, or wafer measurements in the X, Y, Z axis direction. Furthermore, the machine can measure total Surface Form Error (TSFE) or Total Runout (TIR) and display the results in a layout of 2D graphs or 3D surface mapping. The advanced software of Surtronic 3 CPO also facilitates automated reporting and data analysis, making it ideal for research, production and quality assurance applications. In terms of operation, TAYLOR HOBSON Surtronic 3 CPO has high precision linear accuracy of up to 15μm and is capable of operating with various sample and probe settings. Moreover, a high resolution, multi-channel laser line triangulation sensor is incorporated and works in combination with a patented technological line scanning approach to measure surface features with a very high degree of accuracy. To provide for enhanced environmental protection, Surtronic 3 CPO utilises a sealed, dry measuring chamber and a continuous feedback control mechanism to maintain the axial air humidity and temperature levels. Overall, TAYLOR HOBSON Surtronic 3 CPO is well suited for wafer testing and metrology operations across research, development, and manufacturing operations. This tool is well equipped with an extensive range of functionalities, enabling easy setup and accurate measurements with repeatability and reliability.
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