Used TAYLOR HOBSON TalyStep #9048083 for sale

TAYLOR HOBSON TalysStep is a powerful and sophisticated wafer testing and metrology equipment that combines leading-edge technologies with a unique range of features to provide an effective solution for wafer testing and metrology requirements. This system provides a total quality inspection solution that includes optical, electrical, and mechanical properties throughout a wafer. It is designed to provide fast and accurate results as well as reduce manual labor by automating wafer testing and metrology tests. The TalysStep unit operates on a PCI Express 3.0 interface and utilizes a variety of technologies including DDF (Digital Deflection Frame) for image alignment, and motion control for heavily automated processes. It also uses a variety of advanced sensors, such as the DDF (Digital Deflection Frame) for image alignment, the EDLT (Edgeline Distortion Lens Tool) for measuring edge distortion, a digital camera for color and contrast inspection, in-line film thickness mapping, and Infrared (IR) and Raman spectroscopy measurements. The TalysStep machine includes a number of novel features specifically designed for wafer testing and metrology. These include the Ability to Define Multiple Tool Nests (ADtN) feature, which allows for the customization of tool tool sets for specific assemblies. The TalysStep tool also offers an advanced Image Sensor Stage (ISS) for precise tool alignment and an Automatic Focal Plane Calibration (AFC) asset for fine calibration of a wafer surface inspection. Additionally, its modular design allows for wafer testing and metrology parameters to be quickly and accurately adjusted during production. The TalysStep model enables parallelism in the evaluation and measurement of wafers, with multiple sensors used in simultaneous data collection. This equipment is also capable of providing comprehensive information on the quality of silicon wafers and the identification of faults. It is equipped with low-noise amplifiers to ensure accurate and reliable data, and is also able to monitor in-line film thickness as layer of materials may have an impact on wafer performance. The TalysStep system is ideal for a variety of different wafer testing and metrology applications. It provides a flexible solution for wafer mapping, frequency tests, sawing tests, and accuracy tests. The TalysStep unit is also suitable for various wafer designs, such as those used for mobile phones and other telecommunications equipment, imaging and microprocessor substrates, supercomputers, and other aerospace and automotive components and assemblies. In summary, TAYLOR HOBSON TalyStep offers an advanced wafer testing and metrology machine that provides a high level of quality control and accuracy for a range of applications. It is designed for fast and accurate results, as well as reduce manual labor by automating wafer testing and metrology tests. It offers a wide array of features and technologies and is ideal for a variety of different wafer testing and metrology applications.