Used TECHNOS SMAT-200 #293642840 for sale

TECHNOS SMAT-200
ID: 293642840
Wafer Size: 8"
Vintage: 2004
Flim thickness measurement system, 8" 2004 vintage.
TECHNOS SMAT-200 is a high-precision wafer testing and metrology equipment specifically designed for measuring the thickness and flatness of semiconductor wafers. This system combines advanced imaging and scanning techniques with on-the-fly optical metrology for fast, accurate measurements. It features a state-of-the-art image acquisition unit that is capable of capturing high-resolution images of wafers up to 25 micrometers in thickness. The high-speed camera and scan head have a magnification up to 800x and dynamic range of up to 800:1. In addition, SMAT-200 is equipped with a high-precision scanning slit, CCD array sensor, and focused laser diode, allowing for excellent precision and accuracy in measurement. The Machine leverages optical and laser metrology technologies to measure profile, bow, and warp of wafer surfaces with the highest levels of accuracy. The tool offers enhanced data sampling and resolution with ranges up to 6 micrometers and down to 0.1 micrometer, respectively. It also features advanced algorithms for automatically calculating wafer warpage, bow, and flatness, enabling optimal characterization of the surface topography. Additionally, the asset includes a data recording and analysis feature that allows users to analyze the results of their measurements. TECHNOS SMAT-200 offers several advanced features, such as fast edge detection, resolution enhancement, and automated drift compensation. This ensures that the model can provide accurate measurements even under harsh operating conditions. Additionally, it comes with a comprehensive library of measurement techniques for a wide range of wafer metrology applications. All of these features make SMAT-200 an ideal choice for semiconductor manufacturers and production facilities looking for an efficient and reliable wafer testing and metrology equipment.
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