Used THERMA-WAVE Therma-Probe 420 #9238862 for sale

THERMA-WAVE Therma-Probe 420
ID: 9238862
Ion implanter.
THERMA-WAVE Therma-Probe 420 is a wafer testing and metrology equipment that uses optical 3D mapping to provide comprehensive measurements of the height, width, and depth of a wafer for quality control in semiconductor production. Therma-Probe 420 offers precise 3D scan data with up to 20 million points per wafer in less than 3 seconds. It accurately measures topographies and other features with nano-scale resolution, and is capable of acquiring data at resolutions of 0.5 µm x 0.5 µm. The single-shot topography scan offers rapid and reliable measurement of surface characteristics and defect detection. The Automated Geometry measurement calibrates and compensates for wafer topography, thereby ensuring that the data is consistent and reliable across all measurements. The axis to measure parameters like flatness and roundness is fully programmable, allowing for flexibility within each unique production environment. The software applications of THERMA-WAVE Therma-Probe 420 provide complete, detailed analysis of 3D topography images. The system's intuitive software and visualizations enable operators to quickly detect defects and accurately measure surface characteristics. It also offers three optional modules: Advanced Defect Detection, Advanced Feature Analysis, and Advanced Wafer Edge Monitoring. Deformation analysis allows for the comparison of topographies before and after physical or chemical treatments. The Dynamic stitching process, meanwhile, performs real-time stitching of topographies during the scan, offering providers a more accurate and efficient method of obtaining 3D results. The unit's compact design requires minimal floor space at a height of 16.7 inches. It has a dual port capability and is compatible with a range of wafer materials, from 8'' to 200mm. It also works well with both Ceramic and Silicon substrates. All in all, Therma-Probe 420 is the ideal choice for comprehensive wafer testing and metrology. It provides accurate 3D maps and deformation analysis, and its dynamic stitching process ensures results are consistent and reliable. Requiring minimal floor space and compatible with a range of substrates, the machine offers unbeatable performance.
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