Used TOHO FLX-2320-S #9229782 for sale

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ID: 9229782
Film stress temperature measurement system Laser scanning: Measures stress on reflecting films Statistical Process Control (SPC) Elasticity and linear expansion Water diffusion coefficient in dielectric films Linear regression and stress-temperature / Stress-time gradients Thin film stress with very low measurement noise Observation & quantitative evaluation of stress relaxation Oxide densification Thin film phase transformations and annealing Power on.
TOHO FLX-2320-S is a wafer testing and metrology equipment that provides highly precise measurements of semiconductor wafers and substrates. This system is capable of performing a variety of tests including metrology, wafer stress mapping, defect monitoring, electrical resistance measurements, and defect sorting. It features an automated XYZ stage that enables precise wafer alignment and positioning, and its high precision imaging optical unit allows for the capturing of up to eight bit images at 2K resolution. TOHO FLX-2320S is equipped with two vision channels for simultaneous inspection of the surface and edge of a wafer. Each of these channels has an adjustable zoom range from 0.5x to 100x, allowing for highly detailed imaging of both the front and back side of the wafer. Additionally, the machine includes a comprehensive suite of control and analysis software, which enables the user to analyze and image all defects and pattern features down to the 6um level. This software suite is equipped with powerful image processing capabilities that allow for further analysis of defect images. Additionally, the tool comes with an array of high-performance data acquisition and processing boards that enable rapid and accurate measurement of a wide array of wafer parameters. Overall, FLX 2320-S is a reliable and accurate wafer testing and metrology asset for the semiconductor industry. Its highly precise imaging and control capabilities make it an efficient tool for defect analysis and sorting, as well as for measuring critical wafer parameters. Furthermore, its robust design ensures reliable operation even in demanding production environments. The inclusion of powerful analysis software further allows the user to draw meaningful insights from collected data, enabling better optimization of production processes.
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