Used VISION PSYTEC VMX-3100F #9394601 for sale

VISION PSYTEC VMX-3100F
ID: 9394601
Wafer surface measurement systems.
VISION PSYTEC VMX-3100F is a full-featured wafer testing and metrology equipment designed to deliver high throughput and accuracy for complex wafer analysis and characterization. VMX-3100F provides a comprehensive set of metrology tools and processes to measure and analyze wafer performance. It features a unique, integrated design with high-precision motion capabilities, multiple optical imaging systems, and advanced software algorithms to ensure accurate metrology measurements. VISION PSYTEC VMX-3100F has an advanced optical imaging system capable of measuring the fine submicron detail of wafer shapes and patterns. The imaging unit utilizes a 45° tilt and rotation head, allowing for enhanced imaging and improved measurement accuracy. The machine can also accommodate a wide range of wafers, from 25mm to 300mm in diameter. VMX-3100F also features an advanced optical wafer alignment tool to ensure precise wafer alignment prior to testing. The asset has a powerful high-speed metrology engine with integrated tools to analyze different wafer parameters. It is capable of measuring a wide range of wafer parameters, from basic semiconductor chip fabrication to complex device yields. It includes features like non-linear metrology, parametric analysis, yield assessment, unbiased measurement, multiple layer analysis, vision loopback, and multi-view metrology. VISION PSYTEC VMX-3100F also includes advanced software algorithms to ensure highly accurate and reliable metrology results. It includes a data analysis and reporting capability to allow data to be quickly analyzed and results reported. Finally, the model also includes secured data access, ensuring that confidential data is kept secure. VMX-3100F is designed to meet the needs of wafer analysis and characterization, offering an accurate, high-speed, and secure equipment for a variety of applications. This system is ideal for applications such as IC development, device reliability testing, semiconductor chip studying, and process development.
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