Used WYKO / VEECO HD 3300 #9243863 for sale

WYKO / VEECO HD 3300 wafer testing and metrology equipment is an advanced tool for wafer qualification and characterization. It allows for high-resolution topographical analysis of the wafer surface and structure, allowing researchers to identify any issues which can affect the quality of the device. The system is based on laser interferometric displacement sensing technology, and offers up to 8-micron accuracy measurements. It can measure slopes, height variations, and 3D images of the surface, as well as acquiring 2D images of defects. This makes it suitable for detecting and analyzing structures with up to 1-micron resolution. Users can also collect various parameters, including step height, topography, line width, shape and area. The unit comes with a wafer chuck, up to seven axes of motion, and 0.15 µm displacement resolution. It is also equipped with a dedicated, vibration-free environment that is specifically designed to maintain accuracy during measurements. It is also designed with a layer-scanning capability, which enables it to scan through multiple layers of material without damaging the substrate. For automated wafer processing, the machine includes a motorized lift stage, which can be used to automatically scan multiple wafers in sequence. The automated line scan feature allows for complex measurements to be taken without the need for manual intervention. The tool is also optimized for high throughput processes, and comes with an intuitive graphical user interface which simplifies operation. Finally, its modular construction ensures the asset can be tailored to the user's particular needs, from simple to complex wafer analysis. It is designed for scanning up to 150 wafers, and supports up to four analysis systems in parallel. This allows for efficient and high-quality characterization of wafers for research and development purposes.