Used WYKO / VEECO NT 3300 #9304712 for sale
URL successfully copied!
Tap to zoom
ID: 9304712
Vintage: 2004
Optical 3D surface profiler
Measurement technique:
Optical phase-shifting
White light vertical scanning
Interferometry
Measurement capability:
Three-dimensional
Non-contact
Surface profile measurements
COHU 1100 Analog camera
With digital interface board
Digital swap compatible res for 3300: 6612
Camera array size for 3300: 640 x 480
Upgraded LED for 3300
Objectives: 1.5x, 2x
Measurement array:
Maximum array: 736 x 480
Standard: 1000 x 1000
Light source: Tungsten halogen
Lamp: Automated filter selection
Stages:
Manual: ± 2"
X/Y Translation: 200 mm (± 50.8 mm)
Rotation: ± 90°
Tip / Tilt: ± 6°
Options:
Automated: ± 4" (101.6 mm)
X/Y Translation
Automated R/f
Rotation: 360°
Radius: 4" / 8" (101.6 mm / 203.2 mm)
Tip / Tilt head: Motorized / Automated
Optical assembly:
Integrated
Computer-controlled illuminator
Automated discrete zoom with magnification sensing
Automated stages
Closed-loop precision vertical scanning assembly
RS170 Video display: 230 mm
PC Computer
Processor: Pentium
SVGA Monitor, 17" (430 mm)
Live image stays up on SVGA through measurement
Processor: G5
Computer: Windows XP
(24) Monitors
Advanced analyzer
Stitching
Fast automation
GALIL 4-Axis controller
Stage: 8 x 8
Motorized nosepiece
With objective: 5x, 50x
LED Illumination
Performance:
Vertical measurement range:
Standard: 0.1 nm to 1 mm
Vertical resolution: <1A Ra
RMS Repeatability: <0.01 nm
Scan speed:
Standard: Up to 7.2 µm/sec (288 µin./sec)
Lateral spatial sampling: 0.08 to 13.1 µm
Field of view: 8.24 mm to 0.05 mm
Maximum slope: 25° to 1.8°
Reflectivity: 1% to 100%
Environment:
Temperature range: 15° to 30°C (59°F to 86°F)
Non-condensing humidity range: <80%
Power requirements:
Compressed air: 60 - 100 PSI
Input voltage: 100-120 VAC / 200-240 VAC, 50/60 Hz
Power consumption: <300 W
With stage: <400 W
2004 vintage.
WYKO / VEECO NT 3300 is a wafer testing and metrology equipment used to examine the structure and quality of wafers and other thin film materials. The system incorporates a variety of specialized components, allowing for the analysis of a variety of sample types. WYKO NT 3300 can take measurements with spatial and angular accuracy of 1 μm and 0.1° respectively, and can measure over wafers with diameters up to 300 mm. The unit offers a variety of advanced imaging techniques for inspecting thin film devices up to 50 μm thickness. The imaging options are based on an array of high-precision cameras which are capable of capturing images in various lighting conditions. For example, the machine can switch from brightfield to darkfield imaging, allowing for the detecting of defects that may not otherwise be visible. Additionally, it is capable of scanning in non-visible wavelengths such as ultraviolet and infrared, providing more comprehensive coverage of the sample's surface. VEECO NT 3300 boasts a high-speed, high-resolution microscope. Its design includes a motorized precision stage and auto-focusing technology, allowing samples to be quickly moved or focused at any given location. The tool is also compatible with a range of different optics, giving users the option to select the best magnifications for each measurement and imaging task. In addition to its imaging capabilities, NT 3300 features advanced analytical tools, including surface profilometers and three-dimensional imaging tools. The profilometers measure the profile of surface topography with extremely high precision, allowing the user to assess surface finish, roughness, and other sample details. The three-dimensional imaging techniques enable the visualization of sample features in multiple axial planes. In conclusion, WYKO / VEECO NT 3300 is a powerful and versatile asset for wafer testing and metrology. Its precision imaging and analytical tools offer accurate and detailed insights into sample structure and quality, allowing for the detection and optimization of defects and process related issues.
There are no reviews yet