Used YASUNAGA LI-700B #9352419 for sale

YASUNAGA LI-700B is a wafer testing and metrology equipment that provides automated non-destructive review, measurement and analysis of semiconductor wafers. The system helps to improve the process yield by detecting failures at an early stage of production, enabling engineers to make timely corrective action and minimize losses. With its powerful and dependable motor, this unit offers excellent performance while still conserving resources. LI-700B features an 8-inch wafer surface area, a 4-stage magnification change function, and a 5-degrees tilt stage. It also supports a range of measurement and analysis functions such as die-level checking, pattern and external defect inspection, surface roughness measurement, gap width, adhesive thickness, package thickness, and recessed hole diameter. The machine features a direct imaging sensor that can capture defect images with sharp resolution, even in challenging industrial conditions. Multichannel image acquisition and image processing capabilities enable the tool to detect multiple, small processes accurately and quickly. Automated functions minimize the complexity of manual operation and improve overall analysis. Furthermore, the asset offers pattern analysis for multi-die pattern inspection and measurement. YASUNAGA LI-700B is equipped with a USB integrated interface for easy connection with peripheral devices and enables digitizer input for quick data entry. With an intuitive graphical user interface, the model allows easy operation and programming by users without deep technical knowledge. Comprehensive data logging and reporting features provide extensive documentation of process results, while support for SPC statistical functions and consistency in process control help to ensure product reliability and better quality control. LI-700B is a robust, reliable and feature-rich equipment that enables facilities to maintain the highest quality standards in the semiconductor industry. It is ideal for demanding semiconductor production and can help reduce downtime and costs while providing improved yield and enhanced product performance.