Used DNS / DAINIPPON MP-3000 #9095610 for sale

DNS / DAINIPPON MP-3000 is a wet station designed for bench top processing of semiconductor wafers. It is used to clean or dry the wafer substrate with an integrated process chamber under a nitrogen environment. The wet station features a unique automatic programmable process controller that can save up to 15 cycle and 50 program recipes. This allows DNS MP-3000 to develop and repeat standard or process-specific cycle recipes quickly and efficiently. Its low-oxygen environment ensures low-profile die attach processes, while its adjustable temperature range of -55°C to 200°C ensures optimal etch rates without causing thermal bowing or thermal runaway. DAINIPPON MP3000 is equipped with three independent rinse stations and two cavitation systems that enable consistent wet process wafer cleaning. The rinse stations can be adjusted to a fixed repeat rinse timing or an independent repeater stage for each separate rinse. The cavitation systems create molecular-level bubble interactions that break up organic residue quickly and efficiently. The cycle process includes a vacuum chamber for drying the substrate after wet chem process, enabling fast and efficient cycle consistency. MP3000 also features manual and automated lid open/close functions and integrated Leak Gauge Control to maintain high process quality. The drain overflow protection prevents water leakage, while the recirculating filtration system enables cost-efficient process control over a wide range of cleaning agents. Its integrated wafer bow correction system delivers superior substrate flatness without elongating process times. The wet station has intuitive user-friendly touch screen controls that make recipe setup and operation simple and efficient. DNS / DAINIPPON MP3000 has a built-in PC system with a large memory capacity for storing up to 2,000 recipes and 200 sets of production/yield data. It also features integrated communication options for powerful data management capabilities. Its comprehensive design ensures superior wafer surface cleanliness and uniformity, optimized substrate flatness, and superior cycle consistency.