Used DNS / DAINIPPON SU-3200 #293828146 for sale
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ID: 293828146
Wafer Size: 3"
Vintage: 2014
Wafer cleaning system, 3"
(8) Chambers
(4) Load port
Chemical: DHF, NH4OH ,H2O2 ,IPA ,03
Overhead Transport System (OHT)
SINFONIA TECHNOLOGY SELOP12F25-S7DB033F
Double robot arms
Process chamber unit:
Tower-1 : MPC-2,3
Tower-2 : MPC-4,5,6
Tower-3 : MPC-7,8,9
Chemical Cabinet:
SC-1
DHF
O3
CO2
CDA N2
DIW
PCW
FOUP Load port:
(4) Load port
FOUP Type: No N2 Purge
SINFONIA TECH NOLOGY
SELOP12F25-S7DB033F
30D65K-C212 Servo pack
Double robot arms
Material: Ceramic
KAWASAKI
3NT 420B-B029
NT4203452
XU-ACT153L-H01
YASUKAWA ELECTRIC CORP
30D65K-C212 Servo pack
Material: Ceramic
KAWASAKI
3SD940S-A006
SD9400150
E FLOW
e Flow SD90B-R11-F-VB
MPC chamber: 2, 3, 4, 5, 6, 7, 8, 9
Scan nozzle - 1:
Nozzle - 1: DHF (LFC), DIW(LFC)
Suck back drain
Nozzle - 2: O3 (MN), CO2W(MN)
Suck back drain
Nozzle - 3: IPA
Suck back drain
1 Upper nozzle N2 Purge
1 Lower nozzle N2 Purge
1 and 2 Nozzle rinse
Scan nozzle - 2:
Nozzle - 1: SC-1 (LFC), CO2W(MN)
Suck back drain
Nano spray 1: SC-1 (LFC), CO2W(MN)
Nano spray N2
Suck back drain
2 Upper nozzle N2 Purge
2 Lower nozzle N2 Purge
Back side nozzle:
Nozzle chemical dispense: DHF, SC-1, O3 ,CO2
Suck back Drain
Dispense
Fixed nozzle:
Nozzle rinse
Chuck pin rinse
Spin base rinse
Fixed cup
Exhaust duct rinse
Shutter N2 Blow
Chamber wall rinse
Shutter drive: Air cylinder
Chemical cabinet (SC-1):
Mixing tank capacity: 45 Liter
Material: PTFE Teflon
Circulation pump: Pillar / PE-20MA
Pump damper: Pillar / A20S013 / 14722-3
Temp controller: DNS Special
Heating exchange: DNS Special
Temp range: 20 ~ 80°C
(4) Flow meter
(2) Houshing filter
Chemical cabinet (DHF):
Mixing tank capacity: 45 Liter
Material: PTFE Teflon
Circulation pump: Pillar / PE-40MA
Pump damper: A40S018 / 14610-3
(2) Houshing filter
(4) Flow meter
Temp controller: KOMATSU
Heating exchange: KOMATSU
Temp range: 20 ~ 30°C
O3 Cabinet (LIQUOZON):
ASTeX GmbH PN: 14-0038-P00AA1007
DIO3 Outlet pressure: 14 - 36 psi (1.0 ~ 2.5 bar)
O2 Inlet pressure: 65 - 110 psi (4.5 ~ 7.6 bar)
CO2 Inlet pressure: 73 - 36 psi (5.0 ~ 7.6 bar)
UPW Inlet pressure: 48 - 73 psi (3.3 ~ 5.0 bar)
CDA Inlet pressure: 75 - 119 psi (5.2 ~ 8.2 bar)
Main cooling water pressure: 29 psi (2.0 bar)
Max cool water press: 73 psi (5.0 bar)
Missing parts:
Spin base: Material, Spin motor, Revolution, Acceleration, Revolution accuracy
Chuck: Chuck drive, Material, Wafer detection
Main H/D
Spin base (MPC - 2, 3, 4, 5, 6, 7, 8, 9)
MPC board assy (MPC - 2, 3, 4, 5, 6, 7, 8, 9)
MPC flow meter switch (MPC - 2, 3, 4, 5, 6, 7, 8, 9)
CR ROBOT
INDEX ROBOT Servo drive
MPC - 2 (Chemical tray)
Power supply: Phase 3, 208V, 39kVA, 108A (Wire (S)+GND/PE, 50/60Hz
UPS Power supply: Phase 3, 208V, 20VA, 56A (Wire (S)+GND/PE, 50/60Hz
Power supply (4 - wire): 3/PE-200~230V ±10% 14A 50/60Hz
2014 vintage.
DNS / DAINIPPON SU-3200 is a state-of-the-art wet station used in semiconductor manufacturing processes for cleaning, etching, and developing substrates. This versatile tool combines various functions in a single platform, offering high precision and efficiency in processing wafers. With its advanced capabilities and automated features, DNS SU3200 is a critical tool in the production of integrated circuits and other semiconductor devices. At the core of DAINIPPON SU 3200 is its design for accommodating multiple process steps in a single unit. This wet station incorporates various modules, including chemical dispensing, rinsing, drying, and spin coating, allowing for seamless transitions between different processing steps. The modular design of DNS / DAINIPPON SU3200 enables customization and flexibility to meet the specific requirements of different semiconductor fabrication processes. One of the key features of DAINIPPON SU3200 is its precise control over process parameters. The equipment is equipped with advanced sensors and controllers that monitor and adjust key parameters such as temperature, pressure, flow rates, and timing. This level of control ensures uniform and reproducible processing results, critical for achieving high-quality semiconductor devices with tight specifications. In terms of cleaning capabilities, SU3200 excels in removing contaminants from wafer surfaces. The system can perform various cleaning techniques, such as megasonic cleaning, brush cleaning, and chemical etching, depending on the requirements of the process. Additionally, DNS / DAINIPPON SU 3200 has multiple rinse baths with controlled flow rates to ensure thorough removal of cleaning agents and residues from the wafer surface. DNS SU-3200 also supports etching processes for patterning and device fabrication. The unit can handle both wet etching and dry etching processes, providing versatility in creating the desired patterns on semiconductor substrates. The precise control over etchant concentration, temperature, and exposure time allows for accurate and uniform etching across the wafer surface. Another important function of SU 3200 is its ability to perform developing processes for photoresist patterning. The machine can dispense photoresist materials onto the wafer surface, spin-coat them to achieve a uniform layer, and develop the pattern using specialized chemicals. This capability is crucial for defining the features of semiconductor devices with high resolution and accuracy. In addition to its processing capabilities, DAINIPPON SU-3200 is designed for reliability and ease of use. The tool features a user-friendly interface for programming and monitoring processes, as well as diagnostic tools for asset maintenance and troubleshooting. The robust construction and quality components ensure long-term performance and minimal downtime, contributing to overall productivity in semiconductor manufacturing facilities. In conclusion, SU-3200 wet station is a versatile and efficient tool for semiconductor manufacturing processes. With its advanced capabilities in cleaning, etching, developing, and other functions, DNS SU 3200 plays a crucial role in the production of high-quality semiconductor devices. Its precision control, flexibility, and reliability make it a valuable asset in modern semiconductor fabrication facilities.
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