Used LAM RESEARCH / ONTRAK TCP 9400 SE #9402508 for sale
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ID: 9402508
ICP Etcher
Platform: Alliance 4.1
(2) Chambers
Chamber body: HAA
Aligner
Chuck type: BSR Clamp
Process kit:
Bottom electrode, 6"
QUARTZ Disk
Insulator ring
Gas ring
Liner
WDO, QTZ, HTD ENDPT
Cassette type:
LVCE
RVCE
Chamber oring: Viton
Throttle: STD Pendulum valve
ATH 1600 Turbo pump
STD Foreline
Heater jacket: Silicon rubber
Slot valve assembly with STD
Oring of slot valve: Perfluoroelastomer
Endpoint type: 2CH
RF Generator type:
Top: ADVANCED ENERGY RFDS1250 CE Fast loop
Bottom: ADVANCED ENERGY RFDS 1250 HALO
RF Match TCP: Assy T-match, P/N: 853-032294-002
RF Match bottom: RF Match Assy, P/N: 853-330951-021
Manometer: 0.1T/10T MKS
UPC-8130 He UPC
Gas / He line: STD
He STD dump loop
Gas Panel:
Hook up: Side feed side drop
Side exhaust
Load lock / Cassette:
Load lock type: STD VCE
Load lock Platform: STD With HAA coating
STD Cassette
Anti-static load lock cover finish
Enhanced wafer mapping
Integrated cassette sensor
Loadlock indexer: STD type
Loadlock diffuser: STD type
Wafer slide out sensor
Transfer chamber:
MAG 7 Robot
Robot Blade: STD With coating
N2 Purge bottom vent
UPC-8310 Buffer ballast
Aligner: STD Type
Front panel:
Stainless cover
(3) Color signal light tower: Red, yellow, green
Umbilical (75 feet):
Controller to mainframe
AC Rack to controller
AC Rack to mainframe
HX Control cable
Heat exchanger hose
Pump cable
Gases:
CL2 100
BCL3 100
CF4 200
O2 1000
Ar 500
(7) STD Gas lines
(7) STD Inter gas lines
(7) Filters
Power supply: 50/60 Hz.
LAM RESEARCH / ONTRAK TCP 9400 SE is an etcher / asher designed for processing semiconductor wafers, MEMS, MEMS components, and other electronic components. This equipment uses ultra-high vacuum (UHV) technology to offer superior process accuracy and repeatability. It features a 200-mm wafer size, a 126-wafer load lock chamber, and a 100-lb (45.45kg) weight capacity. The UHV design is a fully automated system with a modular configuration, optimized for producing large batches of components. The front-end of the machine contains the process modules which include a plasma source, target chambers, and other components for creating a clean and controlled environment. This unit is designed for etching, deposition and cleaning operations. The etching process uses a high-power plasma source to remove material from the substrate in a highly precise manner. The deposition process utilizes a source to deposit material onto the substrate. The chamber systems helps to create a clean, pure, and stable process environment, minimizing particle contamination and contamination-related defects. The chamber machine of the TCP 940 SE is designed for flexibility, allowing for different process pressures and can reach temperatures up to 400°C. The automated control tool of the asset allows for easy customization and automatic recipe-based processing. Its advanced control model ensures accurate results and maximum throughput. ONTRAK TCP 9400 SE is an excellent choice for applications such as MEMS fabrication, medical device fabrication, and other precision applications. It features the latest technologies in plasma processing and provides advantages such as reliable and repeatable performance, enhanced process accuracy, low internal contamination, and high yield production.
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