Used LAM RESEARCH / ONTRAK TCP 9400 SE #9402508 for sale

ID: 9402508
ICP Etcher Platform: Alliance 4.1 (2) Chambers Chamber body: HAA Aligner Chuck type: BSR Clamp Process kit: Bottom electrode, 6" QUARTZ Disk Insulator ring Gas ring Liner WDO, QTZ, HTD ENDPT Cassette type: LVCE RVCE Chamber oring: Viton Throttle: STD Pendulum valve ATH 1600 Turbo pump STD Foreline Heater jacket: Silicon rubber Slot valve assembly with STD Oring of slot valve: Perfluoroelastomer Endpoint type: 2CH RF Generator type: Top: ADVANCED ENERGY RFDS1250 CE Fast loop Bottom: ADVANCED ENERGY RFDS 1250 HALO RF Match TCP: Assy T-match, P/N: 853-032294-002 RF Match bottom: RF Match Assy, P/N: 853-330951-021 Manometer: 0.1T/10T MKS UPC-8130 He UPC Gas / He line: STD He STD dump loop Gas Panel: Hook up: Side feed side drop Side exhaust Load lock / Cassette: Load lock type: STD VCE Load lock Platform: STD With HAA coating STD Cassette Anti-static load lock cover finish Enhanced wafer mapping Integrated cassette sensor Loadlock indexer: STD type Loadlock diffuser: STD type Wafer slide out sensor Transfer chamber: MAG 7 Robot Robot Blade: STD With coating N2 Purge bottom vent UPC-8310 Buffer ballast Aligner: STD Type Front panel: Stainless cover (3) Color signal light tower: Red, yellow, green Umbilical (75 feet): Controller to mainframe AC Rack to controller AC Rack to mainframe HX Control cable Heat exchanger hose Pump cable Gases: CL2 100 BCL3 100 CF4 200 O2 1000 Ar 500 (7) STD Gas lines (7) STD Inter gas lines (7) Filters Power supply: 50/60 Hz.
LAM RESEARCH / ONTRAK TCP 9400 SE is an etcher / asher designed for processing semiconductor wafers, MEMS, MEMS components, and other electronic components. This equipment uses ultra-high vacuum (UHV) technology to offer superior process accuracy and repeatability. It features a 200-mm wafer size, a 126-wafer load lock chamber, and a 100-lb (45.45kg) weight capacity. The UHV design is a fully automated system with a modular configuration, optimized for producing large batches of components. The front-end of the machine contains the process modules which include a plasma source, target chambers, and other components for creating a clean and controlled environment. This unit is designed for etching, deposition and cleaning operations. The etching process uses a high-power plasma source to remove material from the substrate in a highly precise manner. The deposition process utilizes a source to deposit material onto the substrate. The chamber systems helps to create a clean, pure, and stable process environment, minimizing particle contamination and contamination-related defects. The chamber machine of the TCP 940 SE is designed for flexibility, allowing for different process pressures and can reach temperatures up to 400°C. The automated control tool of the asset allows for easy customization and automatic recipe-based processing. Its advanced control model ensures accurate results and maximum throughput. ONTRAK TCP 9400 SE is an excellent choice for applications such as MEMS fabrication, medical device fabrication, and other precision applications. It features the latest technologies in plasma processing and provides advantages such as reliable and repeatable performance, enhanced process accuracy, low internal contamination, and high yield production.
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