Used KLA / TENCOR / THERMA-WAVE Therma-Probe 630 #9191862 for sale

KLA / TENCOR / THERMA-WAVE Therma-Probe 630 is a versatile and powerful wafer testing and metrology equipment capable of testing and measuring the properties of semiconductor wafers and integrated circuits (ICs). At the heart of the system is a highly sensitive thermal detector. This detector, combined with wafer probing capabilities and metrology software applications, enables the unit to accurately measure a range of wafer properties with an impressive degree of repeatability and accuracy. The machine can analyze a range of semiconductor materials, such as silicon, alumina, silicon-on-insulator, silicon-on-sapphire, polyimide, and gallium arsenide, as well as ICs located on those materials. The tool is primarily used to detect surface defects and process-related parameters, such as leakage current, capacitance, resistivity, and breakdown strength. The asset's non-contact measurement techniques enable users to image the temperature profile of a wafer with an unparalleled level of detail. Metrology software applications are essential for achieving accurate and precise measurements. KLA Therma-Probe 630 is integrated with a range of VIAS software packages, which provide comprehensive integration and analysis of wafer measurements. In addition to automatically imaging wafer profile surface temperatures, the VIAS software can detect, classify, and analyze both linear (wire) defects and small structures (structure edge). Furthermore, the model is highly effective when used for stress measurements. Featuring advanced stress-distortion analysis capabilities, users can quickly and accurately calculate biaxial stress values from profile measurements of surface distortions. The equipment can also detect distortions in thin silicon wafers without degrading the mechanical properties. TENCOR THERMAPROBE 630 is designed to provide superior performance and maximum flexibility. It can be integrated with other wafer testing and metrology systems, such as 790 and Leica systems, and comes with an intuitive user interface for easy navigation and manipulation of data sets. The system also features an array of advanced imaging and analysis capabilities for detecting both physical and electrical properties of semiconductor components. In summary, THERMAPROBE 630 is an advanced wafer testing and metrology unit that provides users with powerful thermal measurement capabilities and versatile metrology software applications. With its impressive level of repeatability and accuracy, it is ideal for quickly and precisely analyzing a range of wafer properties, from surface defects and their dimensions to thermal distortions and stress values.