Used TEL / TOKYO ELECTRON Clean Track Mark 7 #9165473 for sale
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ID: 9165473
Wafer Size: 8"
Coater / (2) Developer system, 8"
Scrubber
Interface
CANON Stepper
Wafer flow: Left to right
Single block.
TEL / TOKYO ELECTRON Clean Track Mark 7 is a mode-selective photoresist equipment with advanced capabilities that enable it to accurately deposit photosensitive films with a variety of desired properties. This system utilizes a three-stage process to ensure uniform film thickness and near-perfect accuracy and resolution for photolithography applications. First, a set of proprietary photozones are established based on specific patterns of material deposition and masking. These zones are then guided by machine vision to direct the deposition of the photoresist film over the pre-determined photozones. The user can select between varying degrees of film thickness depending on the desired type of photolithography, as well as any other additional steps in the process. The second stage involves the application of a plasma pre-treatment that serves to improve the wetting of the photoresist film. A plasma pre-treatment is essentially a low-energy ionized gas that helps to heat up and initiate the photoresist reaction before bonding with the substrate's surface. By controlling the plasma pre-treatment in a variety of ways, the user can selectively adjust the properties of the photoresist film for its intended purpose. The third stage within TEL Clean Track Mark 7 is where the photoresist is exposed to ultraviolet (UV) light. This is generally done with a series of machinery in order to alleviate some of the drawbacks of manual operations. By utilizing multi-axis motion control systems and precision optics, the unit can quickly achieve high-resolution images with perfect acquisition rates. Furthermore, the machine utilizes proprietary software tools to help optimize the resolution and automate the calibration and adjustment of the parameters. TOKYO ELECTRON Clean Track Mark 7 is an ideal tool for photolithography applications due to its precision and uniformity. With its three-stage process, the accuracy and resolution of photoresist deposition can be achieved with a high degree of success. By using the asset, photoresistor materials of various thicknesses can be achieved in a consistent and reliable manner. In addition, the highly automated nature of the model allows for a rapid, efficient process in which the user can expect a great degree of accuracy and resolution.
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