Used ULVAC CME-400ET #9279188 for sale
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ID: 9279188
PECVD system
Load lock type
Vacuum pump: PMB + DRP
Substrate size: 310 × 410 Al Tray (dia.100 × 10, dia.200 × 2)
Power source: RF 1 kW (13.56 MHz)
Deposition material: SiN, SiO
Process gas: NH3, SiH4, N2, N2O, CF4, O2.
ULVAC CME-400ET is a high-performance substrate-ectroplating reactor designed for PVD/CVD, etching, and other applications. This reactor is capable of high speed operation, allowing it to produce superior quality deposits on carrier substrates up to 200mm in size. It is equipped with a Lamination Locator equipment, which ensures accurate etching and pattern transfer during the etching process. The speed and accuracy provided by this system enable the deposition of thin and uniform films. CME-400ET utilizes a low-temperature-arc-sustaining technology to control the substrate-surface temperature. This affects both the process speed and the uniformity and quality of the deposited film. The arc-sustaining technology also ensures that unwanted thermal stress on the substrate is avoided, which is especially important for advanced sensors and highly accurate electronic components. ULVAC CME-400ET is equipped with a high-vacuum chamber and an innovative gas-flow management unit, providing superior cleanness and precise control of the process gas composition. This advanced reactor ensures superior process performance and consistent substrate surface qualities over a wide range of temperatures. To further facilitate high-performance non-reactive processes, CME-400ET is fitted with capacitance-voltage control machine. ULVAC CME-400ET is equipped with a universal remote controller, allowing for easy monitoring, data logging, and parameter adjustment of the chamber conditions. This tool is ideal for researchers who require more precise control over their plating process due to the ability to adjust parameters such as current, gas flow, chamber temperature, and so on. Overall, CME-400ET is a reliable, high-performance reactor with the flexibility to meet the requirements of various applications and substrates. With its superior speed and consistency, this powerful asset is capable of depositing thin, even films on a variety of substrates with little to no thermal stress. Its intelligent design facilitates precise control of process parameters, allowing users to adjust and monitor conditions in real-time to achieve the best possible results.
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