Used KULICKE & SOFFA 7300 CSP #9133763 for sale

KULICKE & SOFFA 7300 CSP is a state-of-the-art "scribing/dicing" equipment designed to perform a two-step die-dicing process. The system combines precision scribing of wafer material with die-dicing, remaining free of contamination throughout. It is the ultimate choice for reliable scribing and dicing of single and multi-die wafers. 7300 CSP features a robust framework designed to support tight control and validations. It consists of a mainframe consisting of a Dicing Unit, a Scribing Unit, and a Process Validation Unit. The Dicing Unit is the heart of the overall unit and allows the CSP machine to perform fast, consistent and clean dicing of the wafer material. The Scribing Unit is used to provide precise positioning and depth of cuts for the wafer dicing process. The scribing can be performed at high speed, with enhanced accuracy from the contactless process. Scribe marks that are used to guide the dicing process are made directly at higher accuracy. The Process Validation Unit runs a variety of tests to ensure process consistency and repeatability, prior to the dicing process. KULICKE & SOFFA 7300 CSP is designed for easy maintenance and can easily be adjusted for the type of wafer used. This allows the tool to be used with a variety of wafer processing materials, such as single or multi-die wafers, as well as both soft and brittle wafer types. The motor drive asset is designed for precise speed control, allowing for reliable scribing and dicing speeds, reducing idle times and speeding up production. The model also has a built-in particle/noise reduction equipment, which enhances process capabilities to reduce contaminations and increase process security. The on-board diagnostics enable an accurate monitoring and control of the system performance. The unit is also compatible with third-party automation systems, allowing easy integration into existing process flow. Overall, 7300 CSP machine is a reliable and efficient "scribing/dicing" tool, capable of performing precision scribing and dicing processes with high throughput and repeatability. The advantages offered by this asset make it an ideal choice for die-dicing processes in the semiconductor and related industries.