Used CANON / ANELVA L-210H-WS #9055191 for sale

CANON / ANELVA L-210H-WS sputtering equipment is a versatile deposition tool for depositing thin film materials onto substrates. The sputtering system consists of two high power magnetron sources and a single work stage. The magnetron sources generate electrons that are accelerated by a high voltage power supply. The accelerated electrons then bombard a target material, transferring material to the substrate through ionized particles, resulting in a thin film coated substrate. CANON L-210H-WS sputtering unit is equipped with two RF magnetron sputtering sources and has an evacuation chamber with a 10-4 Pa maximum pressure. The machine has a temperature range of 25°C to 350°C, and features adjustable pressure, power, and voltage settings. It includes a dust filtration tool to help protect the asset from contaminants, and also includes an integrated cooling model to ensure safe and efficient operation. ANELVA L-210H-WS sputtering equipment can be used for a wide range of applications, including but not limited to thin film silicon oxide/silicon nitride/silicon carbide (SiOx/SiNx/SiCx) films, deposition of copper-oxide (CuO), copper-tin (CuSn), titanium oxide (TiO2) and chromium (Cr) films, adhesion layer coatings, and more. This sputtering system is also capable of depositing metals and conductors, such as aluminum (Al), copper (Cu), and nickel (Ni), to form various layers. L-210H-WS sputtering unit is a high-tech and high-performance machine that is designed to be intuitive, easy-to-use, and reliable. The tool integrates the latest technologies such as remote joystick operation, high-performance chamber evacuation asset, programmable recipe programming, fault alarm function, and easy maintenance. Additionally, the model provides precise process control for reproducible results, ensuring reliable and consistent thin film deposition. Overall, CANON / ANELVA L-210H-WS sputtering equipment is an advanced and powerful deposition tool for depositing films on substrates, enabling superior thin film quality, high resolution, and precise process control. It is suitable for research and development, metrology, rapid prototyping, and nanotechnology applications due to its high performance capabilities. Its intuitive user-friendly interface and advanced features make it a great choice for all types of thin film deposition applications.