Used NOVELLUS MB2 #188659 for sale

NOVELLUS MB2 is a sputter deposition equipment used for thin film applications in the industry. It utilizes an angled target electron beam bombardment across a size range of up to 12-inch diameters, enabling its use in systems with the highest standards of accuracy and precision. By controlling the energetic bombardment of electrons, MB2 is capable of reproducing detailed patterns that adhere to an extremely tight range when combined with the thin film deposition process. The system is also designed to incorporate process monitoring, such as optical emission spectroscopy, across its sputter process windows, delivering faster response times and better quality control over the mechanisms. The sputter source is designed to adapt to a variety of targets. Materials like chromium, molybdenum, gold and silver can be used for large area coverage, providing the customer with more creative applications of the thin film structure. The source also provides independent control of the electron beam current, accelerating voltage, and source size, allowing precise control of the parameters and film profile on the substrate. The sputter chamber also houses a single or double rotatable target which, when combined with innovative cooldown and pre-conditioning procedures, helps to ensure the quality and homogeneity of the targeted area. The unit is also equipped with an advanced windowing feature which allows simultaneous deposition of multiple thin films. This eliminates the need to switch targets, further improving time efficiency and process accuracy. Additionally, the machine includes a precisely controlled RF substrate biasing tool developed to deliver uniform coverage and uniform performance. The biasing technology simplifies the patterning of complex structures while also providing the opportunity to achieve a higher material quality and uniformity. NOVELLUS MB2 also offers a vacuum asset with precision monitoring of pressure, temperature, and magnetron power, as well as nitrogen purge capability for oxidation protection. The model also provides PLC butler operations, along with outlet purge capability, built in safety features, and protection against nozzle breakage. Additionally, the equipment has the ability to save recipes in memory and to monitor multiple process parameters in real-time, making it easier to monitor and maintain high yields and quality assurance standards. In conclusion, MB2 sputter deposition system is designed to be fast, precise, and reliable. With control over parameter settings, use of reactive gases, multiple device windows, and adjustable RF substrate biasing, the unit is designed to provide flexible and precise deposition capabilities. The machine's overall combination of features and process control make it a strong choice for any advanced thin film deposition needs.