Used SIGMA Sputtering System #193698 for sale

ID: 193698
Roll to roll sputtering system 8 Ball Vacuum Chamber & Chassis (2) CTI Model 1020CP Cold Head Cryo Pump (2) CTI Model 1020R Compressors Leybold RuVac WS500 Roots Blower Sliding Door Face Plate Sputtering system: RF Matching Networks Mass Flow Controllers Web system: (4) Black Max Motors & Gearboxes (Unwind, rewind, drum and tension drive) Chilled Drum Drum Motor Stand Control system: Human Machine Interface (HMI) - An operator touch-screen for manual and automated operations HMI - A Eurotherm Drives touchscreen for web control Eurotherm Control Cabinet & Network General Control Panel Utilities and accessories: Chiller Air Compressor Cathode Cooling Water Manifold Flexible Electric Trunking Valving: Roughing Vent and interlocks Cryo gate Cryo throttle Regeneration Purge Gauges: Convection gauges (low mtorr range) Baratron gauges Ion gauges Hydrogen vapor pressure gauges Tension drive, load cells and amplifiers Drum rotation motor and gearbox Rewind and unwind motors Gas system and control PLC card Signal connections Auto pumping Rewind and unwind control Plasma treater Sputtering controls: manual, regulate and direct mode RF control, DC control Maintenance mode Missing parts: Leybold DK200 rough pump (rotary piston pump) DK200 Gearbox (2) Cryo Throttle Valves (Butterfly Valves) (1) Cryo-pump gate valve (2) Hydrogen Vapor Pressure Gauges Ion Gauge Baratron Gauge (4) Convectron Gauges (6) Pneumatic Valves (regeneration valves for cryo pumps; purge valves for cryo pumps, rough pump Vent valves) Chamber Connecting Flange for Drum Feed-through Tension Roller Feed-through Unwind/Rewind Feed-through (6) DC Cathodes (40” x 6”) (6) MDX 5 KW sputtering power supplies Gas Control System Gas Lines (3) Load cells (3) Load Cell Amplifiers (1) Unwind/Rewind Shafts Steel Pressure Plate for Floor Gantry System and Crane (parts missing) Door Drive Train Side Steps to gain access to Cathodes Steel Ladder Mezzanine 480 V, 3 phase, approx. 1,000 A.
SIGMA Sputtering Equipment is an advanced, state-of-the-art Sputtering System designed to deposit thin films onto a substrate. It is used in a variety of applications, such as semiconductor device fabrication, optical coatings, research and development, medical, and many other industries. The unit consists of a small chamber, which is filled with argon gas, and a power supply with a variable voltage setting. A target material, such as aluminum or titanium, is placed on the cathode plate inside the chamber and it is positively charged to generate a plasma. The plasma generates an ionized plasma stream of particles, which bombard the target material, releasing positively charged ions. These ions are then attracted to the negatively charged substrate surface and metal atoms are deposited onto the substrate in a thin layer. SIGMA Sputtering Machine is controlled by a sophisticated software suite that allows users to set a wide range of parameters to achieve optimum results. Users can adjust various parameters to optimize the tool, such as the deposition rate, the ion concentration and the deposition uniformity over time. The software also allows users to monitor and control the deposition rate, enabling them to stop and start as needed without interfering with the final deposition process. Sputtering Asset also features a dry-assist sputter model that helps prevent unwanted particles from attaching to the substrate. The equipment is equipped with a post-process dry etch to further purify the deposit layer by removing any particles or contaminants that may be on the substrate surface. In addition, SIGMA Sputtering System offers a wide array of accessories, such as sample feeders, wafer handlers, cassettes, and fixtures, among other features that make the unit more versatile. Overall, Sputtering Machine is an advanced and reliable solution for metal deposition applications. It's highly customizable and offers users a variety of parameters to choose from to achieve the desired results. Furthermore, its dry-assist and post-process etch features ensure an even and pure deposition layer.
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