Used SIGMA Sputtering System #193698 for sale
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ID: 193698
Roll to roll sputtering system
8 Ball Vacuum Chamber & Chassis
(2) CTI Model 1020CP Cold Head Cryo Pump
(2) CTI Model 1020R Compressors
Leybold RuVac WS500 Roots Blower
Sliding Door Face Plate
Sputtering system:
RF Matching Networks
Mass Flow Controllers
Web system:
(4) Black Max Motors & Gearboxes (Unwind, rewind, drum and tension drive)
Chilled Drum
Drum Motor Stand
Control system:
Human Machine Interface (HMI) - An operator touch-screen for manual and automated operations
HMI - A Eurotherm Drives touchscreen for web control
Eurotherm Control Cabinet & Network
General Control Panel
Utilities and accessories:
Chiller
Air Compressor
Cathode Cooling Water Manifold
Flexible Electric Trunking
Valving:
Roughing
Vent and interlocks
Cryo gate
Cryo throttle
Regeneration
Purge
Gauges:
Convection gauges (low mtorr range)
Baratron gauges
Ion gauges
Hydrogen vapor pressure gauges
Tension drive, load cells and amplifiers
Drum rotation motor and gearbox
Rewind and unwind motors
Gas system and control
PLC card
Signal connections
Auto pumping
Rewind and unwind control
Plasma treater
Sputtering controls: manual, regulate and direct mode
RF control, DC control
Maintenance mode
Missing parts:
Leybold DK200 rough pump (rotary piston pump)
DK200 Gearbox
(2) Cryo Throttle Valves (Butterfly Valves)
(1) Cryo-pump gate valve
(2) Hydrogen Vapor Pressure Gauges
Ion Gauge
Baratron Gauge
(4) Convectron Gauges
(6) Pneumatic Valves (regeneration valves for cryo pumps; purge valves for cryo pumps, rough pump Vent valves)
Chamber Connecting Flange for Drum Feed-through
Tension Roller Feed-through
Unwind/Rewind Feed-through
(6) DC Cathodes (40” x 6”)
(6) MDX 5 KW sputtering power supplies
Gas Control System
Gas Lines
(3) Load cells
(3) Load Cell Amplifiers
(1) Unwind/Rewind Shafts
Steel Pressure Plate for Floor
Gantry System and Crane (parts missing)
Door Drive Train
Side Steps to gain access to Cathodes
Steel Ladder
Mezzanine
480 V, 3 phase, approx. 1,000 A.
SIGMA Sputtering Equipment is an advanced, state-of-the-art Sputtering System designed to deposit thin films onto a substrate. It is used in a variety of applications, such as semiconductor device fabrication, optical coatings, research and development, medical, and many other industries. The unit consists of a small chamber, which is filled with argon gas, and a power supply with a variable voltage setting. A target material, such as aluminum or titanium, is placed on the cathode plate inside the chamber and it is positively charged to generate a plasma. The plasma generates an ionized plasma stream of particles, which bombard the target material, releasing positively charged ions. These ions are then attracted to the negatively charged substrate surface and metal atoms are deposited onto the substrate in a thin layer. SIGMA Sputtering Machine is controlled by a sophisticated software suite that allows users to set a wide range of parameters to achieve optimum results. Users can adjust various parameters to optimize the tool, such as the deposition rate, the ion concentration and the deposition uniformity over time. The software also allows users to monitor and control the deposition rate, enabling them to stop and start as needed without interfering with the final deposition process. Sputtering Asset also features a dry-assist sputter model that helps prevent unwanted particles from attaching to the substrate. The equipment is equipped with a post-process dry etch to further purify the deposit layer by removing any particles or contaminants that may be on the substrate surface. In addition, SIGMA Sputtering System offers a wide array of accessories, such as sample feeders, wafer handlers, cassettes, and fixtures, among other features that make the unit more versatile. Overall, Sputtering Machine is an advanced and reliable solution for metal deposition applications. It's highly customizable and offers users a variety of parameters to choose from to achieve the desired results. Furthermore, its dry-assist and post-process etch features ensure an even and pure deposition layer.
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