Used 3D PLUS KS B6750 #9308271 for sale

ID: 9308271
Vintage: 2013
Polishing cleaner 2013 vintage.
3D PLUS KS B6750 is a state-of-the-art wafer grinding, lapping, and polishing equipment developed for complex wafer applications and demands. With a range of sizes and configuration options, the system offers flexibility to meet any processing needs. KS B6750 wafer grinder operates at high speed for rapid throughput, providing users with the ability to grind and polish large and smaller wafers up to 6 inches in size. The grinding unit includes a powerful spindle, which provides precision and accuracy while removing any surface roughness. Featuring a high-resolution, 3-axis motion control, the machine offers a repeatability accuracy of +/-0.5 micron. This eliminates any surface blemishes and associated surface nonuniformity caused by vibrations. 3D PLUS KS B6750 lapping and polishing tool offers unmatched precision and control. With a brushless, direct drive motor, and integrated pneumatic clamp, the asset can effectively and consistently grind and lap wafers up to 4 inches in size. Utilizing a closed loop, programmable interferometer, KS B6750 has an accuracy tolerance of +/- 2 angstroms while allowing for exponential precision. 3D PLUS KS B6750 can be equipped with an array of grinding, lapping, and polishing accessories, allowing users to process a wide variety of materials. This model is also built for high-capacity operations; it offers automatic wafer loading, indexing and unloading, as well as a 5-cup cassette with an ultra-low capacity of 1000 grit raw material. To enable easy maintenance and optimization, KS B6750 equipment includes a suite of service and diagnostic tools. This includes a maintenance menu, error logs, and machine monitoring. Plus, the system can be upgraded to include a wide variety of options, designed to simplify setup and operation. Overall, 3D PLUS KS B6750 is a essential tool for the high-precision wafer processing industry. With its impressive grind, lap, and polish capabilities, this advanced wafer grinder, lapping, and polishing unit is designed for consistent and reliable results.
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