Used 3D PLUS P2011 0016-2 #9261032 for sale

3D PLUS P2011 0016-2 is a highly sophisticated wafer grinding, lapping and polishing system that provides top-notch process precision and repeatability. This system is built for the specific purpose of grinding, lapping and polishing of semiconductor and optoelectronic wafers to meet exacting requirements precise to sub-angstrom optical flatness and low-micro roughness. The key features of P2011 0016-2 include an ultra-precision direct drive spindle, high stiffness four-axis diamond machining platform, along with state-of-the-art hardware and software solutions. The direct drive spindle can provide high-speed rotation rates of up to 100,000 rpm and feed rates of up to 100 times the spindle speed. This permits the processing of even ultra-hard and brittle substrate materials up to 300mm wafer size with ease and reduces thermal distortions arising from conventional belt-driven spindles. In addition, the four-axis diamond machining platform supports both CCD and laser-based metrology systems for measuring the flatness and roughness of the substrate surface. The resulting servo and post-process errors are corrected through a combined motion control technology which provides excellent profile accuracy. The four-axis machining platform further enables multi-axis freedom to facilitate complex grinding and lapping operations efficiently while maintaining optimum process conditions. Moreover, 3D PLUS P2011 0016-2 is equipped with the latest system control and automation technologies which enable precision machining and automated process control. The advanced multi-tasking and multi-threading Windows-based GUI software interface provides a comprehensive set of graphical tools and menus that facilitate process configuration and monitoring. Furthermore, the built-in six-axis coordinate measuring arm provides quick and easy sample data acquisition, as well as rapid data collection and analysis. P2011 0016-2 is, therefore, an ideal choice for optimizing the throughput of wafer grinding, lapping and polishing operations. With its top-notch accuracy, repeatability, and reliability, it provides a cost-effective and sustainable machining solution that offers years of precise and consistent performance.