Used 3D PLUS P2011-0016-3 #9261035 for sale

3D PLUS P2011-0016-3 wafer grinding, lapping and polishing equipment is an automated system designed to provide quick turnaround times with very high accuracy and repeatability in the grinding, lapping and polishing of silicon wafers. This unit uses a robotic arm and associated vision systems to locate the wafer and accurately place it in the grinding, lapping and polishing tools. The machine can handle silicon wafers up to 200mm in size and has a repeatability of 0.5 microns or better. The machine utilizes a vacuum table to hold the wafer in place during the operation allowing for tight tolerances during the grinding and polishing process. The robotic arm is equipped with a laser for alignment and can be adjusted to provide higher precision. The tool comes pre-programmed with a range of parameters which can be tweaked to accommodate different grinding, lapping and polishing requirements. It also comes with a range of accessories which allow it to be customized to suit a manufacturer's individual needs. The asset allows for the removal of material to a depth of 1.5 microns and is capable of producing wafers to a very high machined surface finish of 8-10 Ra (micrometer). The model allows for multiple passes when machining the wafer to ensure uniformity and repeatability at all stages of the process. The equipment has a high level of safety measures with guards and interlocks to protect the operator from any hazardous material. It can be quickly set up and comes with an intuitive user interface, allowing operators to easily access the available machinery settings. P2011-0016-3 wafer grinding, lapping and polishing system is ideal for both prototype and production runs in the manufacturing of silicon wafers, offering quick turnaround with an excellent and repeatable finish. With its combination of automated process and on-board accessories, this unit is perfect for those in need of a reliable and agile processing solution.