Used 3D PLUS P2011-0016-3 #9261036 for sale

3D PLUS P2011-0016-3 is a state-of-the-art wafer grinding, lapping & polishing equipment designed to provide highly accurate and repeatable surface finishing. This system is perfect for delicate thin-wafer applications, with the ability to process any form of single- or double-sided wafers including flat, biconcave, concave, and various other curved shapes. The unit consists of a CNC-controlled grinding spindle and a lapping polishing table. The grinding spindle is driven by a stepper motor and can accommodate up to 4 tools of different diameters in its quick-change clamping design. It has a maximum rotation speed of 800 RPM and a variable feedrate of 0-1mm/second. Its precision-ground titanium shaft is designed for long life and is designed for ultra-low vibration, providing perfect grinding results. The lapping and polishing table uses a patented 2-dimensional oscillation profile in both the X & Y axes with advanced circularity and equilibrium, achieving perfectly flat and polished surfaces. The table can accommodate a variety of wafer sizes up to 450mm and with a maximum load of 200 kg, ensuring reliable results. P2011-0016-3 also comes with a wide variety of accessories, including various grinding tools, abrasive papers, brush assembly and lapping films. These are interchangeable to accommodate any specific application needs. Additionally, the machine is integrated with advanced safety features such as a pressure-sensing spindle guard and other peripherals to ensure the highest level of safety. Overall, 3D PLUS P2011-0016-3 is designed to provide fast, consistent, and reliable surface finishing on a wide variety of thin-wafers. Its advanced CNC controlled grinding & lapping tool is both user friendly and powerful, and provides precise and repeatable results time after time. With its wide range of interchangeable grinding and polishing tools and accessories, P2011-0016-3 is the ideal asset for any precision grinding, lapping, and polishing application.