Used 3D PLUS P2011 0016-6 #9261046 for sale

3D PLUS P2011 0016-6 is a multifunctional wafer grinding, lapping, and polishing equipment capable of performing all three operations on a single platform. The system is designed to process wafers and silicon-silicon oxide substrates with a diameter range of 125mm to 200mm, with a minimum thickness as small as 0.3mm and up to 0.3mm in thickness. The unit has both manual and automatic functions, allowing operators to select the appropriate method for their specific applications. The machine includes an integrated CCD alignment scope for accurate positioning of wafers and substrates, and a high resolution XY positioning tool for precise positioning of grinding, lapping and polishing operations. The asset has a powerful drive mechanism and an advanced control model for smooth and accurate operation. It also features air bearing linear slides for consistent and precise motion control. For grinding, the equipment has an electronically driven grinding head equipped with diamond-impregnated wheels. This ensures a consistent surface finish on the wafer and substrate. The diamond-impregnated wheels have an operating speed range of up to 10,000rpm, and are self-regulating and self-cleaning, making them safe to use and ensuring a stable grinding process. For lapping and polishing, the system is equipped with a spindle-driven lapping and polishing head as well as dual motorized polishing heads. This means that a single platform can perform all three operations. The unit also includes a pressure transducer to monitor the pressure levels applied to the substrates. P2011 0016-6 is designed for high-precision performance, and includes a user-friendly graphical user interface to monitor and control operations. Its intuitive controls and easy-to-use interface allow operators to quickly and accurately set up and operate the machine. The tool is also equipped with automatic wafer chucking and wafer unloads, making it highly efficient and cost-effective. 3D PLUS P2011 0016-6 is suitable for use in a variety of industries, including semiconductor, aerospace, automotive, medical and consumer electronics. It is widely used for surface processing applications such as flattening, edge and fine grinding, lapping and polishing, and is designed to meet the stringent requirements of precision and accuracy.