Used ADVANCE HG-6B #9256742 for sale

ADVANCE HG-6B is a wafer grinding, lapping and polishing equipment designed for fabricating ultra-precision, high-degree planar surfaces on a range of substrates. It is widely used in the semiconductor, flat panel display, thin film head and wafer level packaging industries. HG-6B is a fully automated system, featuring an innovative grinding process that is extremely efficient and cost-effective. The closed-loop control unit enables a user to optimise the process parameters and ensure a consistent surface quality over the entire wafer. The machine can be loaded with up to 25 wafers and is able to process them at speeds of up to 200 wafers per hour. The grinding process involves a fast, precise grinding technique that utilises an abrasive diamond compound between a grinding head and the wafer, removing a thin layer of material quickly and efficiently. The head is driven by a linear motor, which provides high accuracy and repeatability. The tool also includes an internal cooling unit, which maintains the temperature at the grinding head for optimal results. ADVANCE HG-6B also features a top and bottom polishing asset, which enables high-level planar surfaces to be achieved. The top polishing model uses a raceway of variable speed rotary surface plates that guide a polishing walnut shell and slurry film, while the bottom equipment uses a compressed air system to guide the slurry. HG-6B is a reliable and highly accurate wafer grinding, lapping and polishing unit, providing a cost-effective solution for meeting the demands of the semiconductor, flat panel display, thin film head and wafer level packaging industries. With its advanced technology, it ensures superior surface quality and consistency, while providing an efficient and consistent wafer processing capability.