Used ADVANCE HG-6B #9257116 for sale

ADVANCE HG-6B is a specialized wafer grinding, lapping and polishing equipment used for semiconductor wafer processing. It offers a rapid, yet controlled, grinding motion for controlled thickness reduction and form generation. It features a Compact LowProfile Grinder (CLPG) unit that is designed to optimize contact and pressure between the grinding wheel and the wafer surface, creating a uniform grinding motion. The system is equipped with three CNC axes that enable independent motion of the grinding wheel along the X, Y, and Z axes. This allows for precise and repeatable thickness control, even when machining complex shapes, such as cube and cone-shaped wafers. The unit also includes a CNC feeding machine that enables precise control of grinding head feed rate and motion. By controlling the feed rate and motion, this tool allows for precise planar grinding. HG-6B asset comes with a built-in dual axis lapping model, which allows for wafer lapping without the need for additional tools or fixturing. This equipment is combined with the lapping motor to impart a high-frequency orbital motion to the lapping plate. This allows for efficient and repeatable lapping operations. Additionally, ADVANCE HG-6B offers a polishing platen along with a separate rotatable motor that is used to drive the plate. This allows for precise planar polishing. HG-6B is a top-quality wafer grinding, lapping, and polishing system that is ideal for high-precision machining operations. Its advanced features allow for repeatable yet cost-effective machining operations, while its robust construction and high-quality components provide years of reliable service. Furthermore, its large work area and advanced programming interface make it easy to use and maintain. Thus, ADVANCE HG-6B is the ideal platform for machining a wide variety of semiconductor wafers.