Used AM TECHNOLOGY ADL-1000 #9137904 for sale

AM TECHNOLOGY ADL-1000 Wafer Grinding, Lapping & Polishing equipment is an automated material processing system designed to efficiently and accurately grind, lap, and polish wafers for semiconductor, solar, and other applications. The unit features a conveyor machine that can transport up to four, six, or twelve wafers at a time, allowing for processing of a large volume of wafers in a fraction of the time of manual methods. ADL-1000 works with wafer sizes up to two hundred fifty millimeters in diameter and is capable of grinding wafers up to 6um in thickness. The tool utilizes a fixed-grinding wheel that is driven by a motor and is capable of generating steady, low-force grinding motions. The up-and-down grinding head is precisely controlled by a stepper motor and encoder, so the grinding force remains constant. AM TECHNOLOGY ADL-1000 also employs a patent-pending, high-precision contactless sensor that monitors the wafer's thickness as it enters the grinding station. This ensures that the grinding process is not only accurate, but also repeatable. The lapping asset utilizes an integrated, highly efficient air abrasion nozzle that is capable of generating a uniform and consistent lapping surface over the entire wafer. This model features a pressure-balanced rotor that produces a high lapping speed and rate, while significantly reducing vibration and achieving optimal flatness with minimal downtime. The lapping station also incorporates a sensor that monitors the wafer's surface in order to maintain a uniform finish. The polishing equipment uses a multi-axis head that is adjustable and designed to ensure the correct pressure and speed for the best results. The system utilizes a platen mechanism for a flexible range of motion, allowing for optimal force and pressure control. Additionally, ADL-1000 features an overhead polishing wheel capable of up to 1000 rpm and features a low-force design to minimize any resulting stress on the wafer. AM TECHNOLOGY ADL-1000 is a comprehensive and versatile unit that utilizes advanced automation processes and technologies to increase efficiency and reduce costs associated with grinding, lapping, and polishing wafers for various materials processing applications. With its reliable operation, user-friendly interface, and high precision components, ADL-1000 is the ideal choice for semiconductor, solar, and other wafer processing applications.