Used AM TECHNOLOGY ASP-810 #9279038 for sale

AM TECHNOLOGY ASP-810 is a sophisticated wafer grinding, lapping & polishing equipment ideal for industrial, scientific and research applications. The system is reliable, robust and efficient, ensuring superior quality and consistency of your end product. It offers a wide range of process parameters from de-burring, soft lapping, hard lapping to fine grinding & polishing on both hard and soft materials and a wide selection of tooling and abrasives. ASP-810 is a high-precision, non-contact grinding process, which utilizes a unique spindles suspended linear Motor drive design to achieve a micro-meter resolution of process data. The control unit continuously monitors the grinding process and feedback is adjusted automatically, allowing for improved accuracy and higher levels of precision. The machine has an intuitive user interface, which makes setup and operation easy and efficient and includes an integrated inspection and diagnostics tool. AM TECHNOLOGY ASP-810 utilizes a belt-free looping technology which results in a reduced particle count and improved wafer surface uniformity. The asset is compatible with different types of wafer materials such as quartz, silicon, gallium nitride, aluminum, and ceramic. It offers a wide range of grinding parameters such as grinding speed, spindle speed, pressure control, step grinding, and polishing, allowing for greater control over the final product. The model offers enhanced safety through its integrated double door & interlock feature. This ensures that the equipment is engaged only when the grinding wheels are safely covered inside the hood to prevent any potential hazards. The system is equipped with two axis (X and Y) belt drive linear motor design for faster and smoother operation. The 80-motor multi-step pulley drive allows for precise speed control with a resolution of 0.001 RPM. ASP-810 is CE and ISO 9001 certified and comes with a two year warranty. The service and technical support team is available for 24/7. The unit is ideal for industrial grinding applications such as wafer mapping, edge shape control, flatness and thickness control and thin film deposition. It is also ideal for scientific applications such as micro defect detection, metrology, failure analysis and more.