Used CERATEC JAPAN HiAZ-A700SSE #9143376 for sale

CERATEC JAPAN HiAZ-A700SSE is a high-precision wafer grinding, lapping, and polishing equipment that provides a reliable and efficient solution for the shaping of a wide variety of wafers. The system features a high pressure water jet unit for cutting and grinding hard materials including SiC, sapphire, quartz, and diamond, as well as a double stage lapping and polishing station with ceramic polishing belts and diamond slurry. The machine also includes a vibration isolation table for ultimate stability while working on the wafers. The double lapping and polishing station is powered by two separate motors - one motor for the lapping procedure and another motor for the polishing process. The lapping station utilizes the ceramic belt to apply pressure to the wafer surface while it is covered with diamond slurries. The coarse grits of the diamond slurries are used to grind the wafer surface, while the finer grits are used to smooth the surface of the wafer. The polishing station utilizes the ceramic belt to apply gentle pressure to the wafer surface while it is covered with the diamond slurries. The finer grade diamond slurries are used to polish the wafer surface. HiAZ-A700SSE also features a 100kHz variable frequency motor, so that the speed of the lapping and polishing process can be adjusted according to the user's needs. The tool features a high precision water jet asset for cutting even the most difficult materials. The water jet model is equipped with a precision linear motion equipment designed for superior accuracy when cutting. The system is powered by a servo motor, providing good positioning accuracy when cutting the wafers. The pressure of the water jet can be adjusted to the user's needs, allowing for a wide variety of cutting applications. The unit is also equipped with a vibrational isolation table that ensures a stable work environment. The table is made from a rigid steel frame with integrated vibration damping elements to reduce the transmission of vibration from the floor to the working surfaces. This design is ideal for ensuring accuracy and stability when machining the wafers. CERATEC JAPAN HiAZ-A700SSE is a highly precise wafer grinding, lapping and polishing machine suited for a wide range of applications. The tool provides a reliable and efficient solution for shaping a wide variety of wafers. The double stage lapping and polishing station, precision water jet asset, and vibrational isolation table provide accurate results, ensuring that the user is satisfied with the output of the model.