Used CERATEC JAPAN HiAZ-A700SSE #9216426 for sale

CERATEC JAPAN HiAZ-A700SSE Wafer Grinding, Lapping and Polishing Equipment is designed for the production of high-quality, advanced-grade silicon-on-insulator (SOI) wafers. The system is highly flexible, allowing for sharpening, lapping, and polishing in one instrument and can be customized to meet a variety of advanced wafer processing needs. HiAZ-A700SSE consists of a controller unit, a main grinding unit, two auxiliary grinding and lapping units, and a polishing unit. All components are made of high-quality materials and have a long lifespan. The main grinding unit uses vibration technology and is powered by an advanced digital motor that can achieve fast speed and high accuracy. It is capable of separating wafers into four layers in a single pass, with high accuracy and fine work piece edges. The two auxiliary grinding and lapping units feature a variable angle adjustment mechanism for optimal results, as well as an automatic height and center adjustment. The polishing unit is equipped with an advanced optical sensor and highly precise mechanical components, enabling it to achieve uniform and smooth surfaces without any visible scratches. CERATEC JAPAN HiAZ-A700SSE is easy to operate and can be programmed to meet specific customer needs. It also features an extensive range of safety and monitoring functions, ensuring efficient and secure operation. Safety features include a microprocessor-controlled emergency stop button, an inrush circuit, and a low-vibration warning light. The unit is also designed to regulate the air pressure, to maintain consistent and optimal grinding performance. HiAZ-A700SSE is an efficient and reliable wafer grinding, lapping and polishing machine, capable of producing high-quality, advanced-grade silicon-on-insulator (SOI) wafers. It is made of high-quality materials, easy to operate and offers a range of safety and monitoring functions for secure, efficient grinding, lapping and polishing processes.