Used CUSTOM 72" #9062595 for sale
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ID: 9062595
Continuous polisher / Lapper
With optical pitch
No pitch cutter
Plate thickness: 4"
(3) Retaining rings
Ring thickness: 2.5"-3"
Set for optics
Motor for turn table
Motor for rings
Alumnium lapping rings
Drive wheel included
Includes:
(3) Rings / Workstations
Conditioner
Jigs / Carriers.
CUSTOM 72" is a wafer grinding, lapping and polishing equipment capable of handling up to 200mm diameter wafers of any thickness. It features the latest advances in high tech grinding, lapping and polishing technology, allowing it to grind and lap a wide variety of materials to submicron tolerances on the nanometer level. The system comes with a heavy-duty air bearing spindle for ultra-precise grinding at high speeds. It is lubrication free and provides exceptional accuracy, smoothness and finish all the way up to 50,000 rpm. This allows for superior performance and precision when grinding, lapping and polishing small areas of a large substrate. 72" also has specialty diamond lapping tools to finish the grinding and lapping process with sub-micron accuracy. The standard diamond tool unit is designed for fast and effective wafer grinding, lapping and polishing. The diamond tools are also adjustable to accommodate different substrate materials and configurations, allowing for CUSTOM precision that is required when working with thin and fragile substrates. CUSTOM 72" is also equipped with a high-performance vacuum machine that keeps the dust free environment necessary for precision polishing of the substrate. The vacuum tool is air cooled and designed to reduce wear and tear on all the components and increase reliability. The asset is very user friendly and easy to set up and operate. It also integrates well with other processing or polishing systems. The user interface is designed to be intuitive and easy to use, with information displays and controls that can be manipulated on the fly. The graphical user interface makes it easy to monitor and adjust settings during operations. 72" is one of the most advanced and complete wafer grinding, lapping and polishing systems available on the market today. It is an ideal choice for demanding applications where precise and repeatable results are required. The model can handle a wide variety of wafer sizes and is expandable as the needs of the user change. CUSTOM 72" is an innovative and powerful tool in the semiconductor and precision polishing industry.
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