Used DAITRON BN3-S54 #9127745 for sale

DAITRON BN3-S54 is a highly advanced wafer grinding, lapping, and polishing equipment specifically designed to meet the industry's most stringent requirements. With features such as an integrated auto-focus monitor and a high-powered motor, this system is capable of producing consistent and precise results with great ease and efficiency. Utilizing a three-axis control unit, BN3-S54 is able to provide operability and accuracy with even the most challenging materials. With its dual-headed grinding wheel and high-powered motor, DAITRON BN3-S54 is capable of achieving both accuracy and speed when performing lapping and polishing processes. Moreover, the three-axis control ensures that the entire process is automated, meaning that only minimal operator intervention is required for a polished, high-grade finish. Furthermore, the integrated auto-focus monitor of BN3-S54 allows for even the finest details of the surface to be examined during lapping and polishing. This ensures that any irregularities are identified and corrected during the process. The monitor also allows for the operator to be aware of any sudden changes in the surface such as chips and scratches, as these can significantly affect the overall finish of the surface. Additionally, the automated focus feature allows for easy alignment and accuracy in the lapping and polishing process. TheDAITRON DAITRON BN3-S54 also features an intelligent computerized control machine. This tool allows for greater efficiency and performance by providing automatic adjustment of movement, limited contact amongst the components, and precise correction of the surface. Overall, BN3-S54 is an exceptionally reliable wafer grinding, lapping, and polishing asset. Its integrated auto-focus monitor and high-powered motor enable DAITRON BN3-S54 to perform precise and consistent finishes with great ease and efficiency. Additionally, the intelligent computerized control model ensures greater accuracy and performance, making it the perfect fit for any project that requires industrial-grade wafer grinding, lapping, or polishing.