Used DAITRON DBM-402B #9379136 for sale

DAITRON DBM-402B is a sophisticated wafer grinding, lapping, and polishing equipment. This system is a cost-effective, full-featured solution for grinding and lapping both semiconductor wafers and glass substrates. It uses high precision flat grinders and polishers, combined with an advanced precision spindle and motor drive. Its precision and accuracy ensure a highly consistent polish that achieves the highest quality surface finish with minimal defects. The unit takes advantage of a number of advanced technologies in order to achieve the highest level of accuracy and surface finish. In particular, it utilizes dynamic stiffness control of the spindle motor to reduce motor noise and vibration, thus providing a smooth and uniform grinding motion. It also utilizes electronic speed control, allowing the machine to accurately control and adjust the speed of the grinders so that they can achieve the desired results regardless of the material being processed. In addition, the tool has a range of features which help to ensure the quality of the final polishing, including on-board monitoring and an autofocus mechanism which helps to reduce variability in polish results. Additionally, the asset's advanced software provides operators with precise controls over the model's parameters, allowing them to easily adjust the machine's settings and ensure that they're operating at optimal parameters. The equipment has a number of other features which make it a great choice for wafer grinding, lapping, and polishing. It allows for a wide range of abrasive grit sizes, as well as multiple types of polishing pads. This means that operators can choose the right type of pad based on the material they're working with. Additionally, the machine utilizes an adaptive diamond cutting technology that allows for a high level of accuracy when grinding, lapping, and polishing. Furthermore, the system has a robust electronics platform, allowing for easy upgradeability and maintenance. Overall, DBM-402B is a powerful and versatile wafer grinding, lapping, and polishing unit. Its precision spindle and motor drive, combined with advanced technologies such as dynamic stiffness control, electronic speed control, and autofocus, allow for a high level of accuracy and surface finish. This, combined with its range of settings and features, make it the perfect choice for applications which require a consistently high-quality finish.