Used DAITRON DBM-402R #293629389 for sale

DAITRON DBM-402R Wafer Grinding, Lapping and Polishing Equipment is a precision system designed for high-precision fine machining of wafer-level components including silicon wafers, compound semiconductors, and other hard and fragile materials. The unit is fully automatic and features the latest computer-controlled technologies to provide the highest levels of accuracy and repeatability in a production environment. The machine includes a spindle motor which is capable of maintaining high spindle speeds required for fine grinding and polishing operations. An efficient circulation tool is used to keep the workpiece cool during machining. The spindle motor is protected from dust and debris by a microfiltered circulating air shield. A power delivery asset provides consistent power and torque to the spindle motor, allowing for greater consistency when machining irregularly shaped pieces and high-precision components. DBM-402R also features a confocal microscope, which enables the operator to inspect the workpiece in real-time, which is essential for achieving high-precision finishes. The microscope allows for the detection of any defects or irregularities in the workpiece before grinding, allowing the operator to make immediate corrections as needed. The machine is also equipped with two grinding and polishing fixtures with high repeatability and accuracy. These fixtures can be used to accurately shape and polish the workpiece, achieving precision tolerances. The model is also equipped with a specialized jig, which can be used to accurately locate and fix the workpieces on the machine table. In addition to grinding, lapping and polishing, DAITRON DBM-402R can also be used for abrasive machining processes such as CNC milling and drilling. The equipment is also equipped with a range of measuring devices, allowing for high-level accuracy verification and inspection. Overall, DBM-402R Wafer Grinding, Lapping and Polishing System is a powerful and versatile machine which is engineered for precision, accuracy, and reliability. It is suitable for a range of applications in the electronics and semiconductor industry, providing a full suite of machining capabilities for high-precision workpieces.